Journal ArticleDOI
Experimental investigation on controlled cooling by coupling of thermoelectric and an air impinging jet for CPU
Abdelillah Abed Belarbi,M’hamed Beriache,Nor Azwadi Che Sidik,Rizalman Mamat +3 more
- Vol. 50, Iss: 3, pp 2242-2258
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The article was published on 2021-05-01. It has received 7 citations till now. The article focuses on the topics: Jet (fluid) & Electronics cooling.read more
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Journal ArticleDOI
A review of the state-of-the-art in electronic cooling
TL;DR: In this paper, the state-of-the-art in electronic cooling, classified into direct and indirect cooling, are reviewed and discussed in detail, along with the pros and cons of these thermal management methods.
Journal ArticleDOI
Effect of Liquid Saturated Porous Medium on Heat Transfer from Thermoelectric Generator
M. A. Mansour,N. Beithou,Ali M. Othman,Ahmed Qandil,Mohammad Bani Khalid,Gabriel Borowski,Sameh Alsaqoor,Ali Alahmer,Hussam Jouhara +8 more
TL;DR: In this article , the effect of heat transfer rate on the performance of TEGs under both steady and transient conditions was analyzed using a liquid saturated porous medium, and the experimental results showed that power generated with Cu particles exceeds that of Al particles with 14%.
Journal ArticleDOI
Smart microchannel heat exchanger based on the adaptive deformation effect of shape memory alloys
TL;DR: In this paper, a shape memory alloy vortex generator (SMA-VG) was proposed to address the challenges associated with complex working conditions and random hotspots of electronic components, which can automatically adjust to change the flow characteristics of the microchannel, such that the cooling capacity and heat dissipation demand can be matched intelligently without external control.
Journal ArticleDOI
Investigation of fluid flow and heat transfer in a narrow channel with micro barchan-dune-shaped humps
TL;DR: In this paper , an innovative bionic heat sink with micro barchan-dune-shaped humps for improving the flow and heat transfer performance of the smooth narrow channel was proposed.
Journal ArticleDOI
Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules
TL;DR: In this paper, the authors used thermoelectric modules (TEMs) for cooling chip hotspots of different heat fluxes, which is called sustainable self-cooling framework (SSCF).
References
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Journal ArticleDOI
Thermoelectric mini cooler coupled with micro thermosiphon for CPU cooling system
TL;DR: In this paper, a thermoelectric mini cooler coupling with a micro thermosiphon cooling system has been proposed for the purpose of CPU cooling, and the relationship between the maximal COP (Coefficient of Performance) and Q c with the figure of merit was demonstrated.
Journal ArticleDOI
Design optimization of thermoelectric cooling systems for applications in electronic devices
Yuanyuan Zhou,Jianlin Yu +1 more
TL;DR: In this article, a generalized theoretical model for the optimization of a thermoelectric cooling (TEC) system, in which the thermal conductances from the hot and cold sides of the system are taken into account, is presented.
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Thermoelectric water-cooling device applied to electronic equipment
TL;DR: In this paper, the authors investigated the thermal performance of a thermoelectric water-cooling device for electronic equipment and developed a novel analytical model of thermal analogy network to predict the thermal capability.
Journal ArticleDOI
An experimental and computational investigation of thermal air flows through perforated pin heat sinks
TL;DR: The benefits of using pin fin heat sinks with multiple perforations using complementary experimental and Computational Fluid Dynamics (CFD) methods were investigated by as mentioned in this paper, which showed that the effect of perforated pin fin design on heat transfer and pressure drops across the heat sinks was found to agree with predictions from a CFD model for the conjugate heat transfer into the cooling air stream.
Journal ArticleDOI
Numerical investigation for optimizing segmented micro-channel heat sink by Taguchi-Grey method
Nor Haziq Naqiuddin,Lip Huat Saw,Ming Chian Yew,Farazila Yusof,Hiew Mun Poon,Zuansi Cai,Hui San Thiam +6 more
TL;DR: In this article, a novel segmented micro-channel is introduced to improve the thermal performance of the straight-channel heat sink, and the bottom of the heat sink is subjected to a constant heat flux condition and water is used as a coolant.