Journal ArticleDOI
Growth behavior of electroless Ni–Co–P deposits on Fe
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TLDR
In this paper, the effect of the mol ratio of CoSO 4 /CoSO 4 ǫ+NiSO 4 in plating bath on the growth behavior of electroless Ni-Co-P films was studied.About:
This article is published in Applied Surface Science.The article was published on 2009-01-01. It has received 23 citations till now. The article focuses on the topics: Plating & Sodium hypophosphite.read more
Citations
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Preparation and characterization of electroless Ni–Co–P ternary alloy on fly ash cenospheres
TL;DR: In this paper, the process of ternary Ni-Co-P alloy films deposited on fly ash cenospheres (FACs) through a modified electroless plating way is documented.
Journal ArticleDOI
Corrosion Resistance Enhancement of AZ91D Magnesium Alloy by Electroless Ni-Co-P Coating and Ni-Co-P-SiO2 Nanocomposite
TL;DR: In this article, Ni-Co-P-SiO2 nanocomposites were applied on AZ91D magnesium alloy via environmentally friendly cerium-lanthanum-permanganate treatment and their properties were compared with traditionally binary Ni-P coating.
Journal Article
Electroless Ni-Co-P Coating of Cenospheres Using Ag(NH_3)_2~+ Activator
TL;DR: In this paper, the electroless Ni-Co-P-coating of fly-ash cenosphere particles is demonstrated by modifying the conventional sensitization and activation steps with only using activation step with Ag(NH3)2+ activator.
Journal ArticleDOI
Study of different aluminum alloy substrates coated with Ni–Co–P as metallic bipolar plates for PEM fuel cell applications
TL;DR: In this paper, the surface morphology and chemical composition of coated aluminum substrates were examined using potentiodynamic polarization technique in (0.5m H2SO4+2m HF) solution and their performance against corrosion was examined during long-time operation under cathodic environment in PEMFCs.
Journal ArticleDOI
Combinatorial performance characteristics of agitated nickel hypophosphite electroless plating baths
TL;DR: In this article, the combinatorial performance characteristics of agitated sodium hypophosphite electroless plating baths were evaluated and the plating characteristics were investigated for a wide range of nickel solution concentrations.
References
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Journal ArticleDOI
Electrolessly deposited diffusion barriers for microelectronics
Eugene J. O'Sullivan,A. G. Schrott,Milan Paunovic,Carlos J. Sambucetti,J. R. Marino,P. J. Bailey,Suryanarayana Kaja,K. W. Semkow +7 more
TL;DR: Electrolessly deposited materials were investigated as possible diffusion barrier layers for multilayer microelectronic structures, and electroless Ni(P) significantly increased the Cu resistivity through interdiffusion and was the most effective barrier to Cu diffusion at elevated temperature.
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Preparation, characterization and microwave absorption properties of electroless Ni–Co–P-coated SiC powder
TL;DR: In this paper, a two-step electroless plating process was used to pre-treatment sensitizing and subsequent plating for the application to lightweight microwave absorbers, which were characterized by scanning electron microscopy (SEM), X-ray diffraction analysis (XRD), vibrating sample magnetometer (VSM), and vector network analyzer, respectively.
Journal ArticleDOI
Electroless Ni–Co–P ternary alloy deposits: preparation and characteristics
TL;DR: The plating rate of electroless Ni-Co-P ternary alloy deposits is a function of concentration of sodium hypophosphite, pH of the plating bath, plating time and the metallic ratio as mentioned in this paper.
Journal ArticleDOI
Electrophoreted Zn–TiO2–ZnO nanocomposite coating films for photocatalytic degradation of 2-chlorophenol
TL;DR: In this article, a nano-powders with different TiO2/ZnO ratios have been synthesized by hydrothermal method by using X-ray diffraction, scanning electron microscopy and energy dispersive Xray analysis.
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Nanocrystalline soft ferromagnetic Ni–Co–P thin film on Al alloy by low temperature electroless deposition
TL;DR: In this article, soft ferromagnetic ternary Ni-Co-P films were deposited onto Al 6061 alloy from low temperature Ni−Co−P electroless plating bath and the effect of deposition parameters, such as time and pH, on the plating rate of the deposit were examined.