Proceedings ArticleDOI
High-Aspect-Ratio Fine Cu Sidewall Interconnection over Chip Edge with Tapered Polymer for MEMS-LSI Multi-Chip Module
Akihiro Noriki,Y. Kaiho,E. Iwata,Yoshikazu Ohara,M. Murugesan,K. W. Lee,Jichoel Bea,Takafumi Fukushima,Tetsu Tanaka,Mitsumasa Koyanagi +9 more
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This article is published in The Japan Society of Applied Physics.The article was published on 2009-10-07. It has received 3 citations till now. The article focuses on the topics: Chip & Interconnection.read more
Citations
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Journal ArticleDOI
Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems
Kang-Wook Lee,Akihiro Noriki,Koji Kiyoyama,Takafumi Fukushima,Tetsu Tanaka,Mitsumasa Koyanagi +5 more
TL;DR: The basic functions of individual chips of LSI, MEMS, and photonics devices as they were integrated into the3-D optoelectronic multichip module to verify the applied 3-D hybrid integration technology.
Patent
Backside integration of RF filters for RF front end modules and design structure
James W. Adkisson,Panglijen Candra,Thomas J. Dunbar,Jeffrey P. Gambino,Mark D. Jaffe,Anthony K. Stamper,Randy Wolf +6 more
TL;DR: In this article, a design structure for an integrated radio frequency (RF) filter on a backside of a semiconductor substrate is presented, which includes a device on the first side of a substrate, a radio frequency filter on the back side of the substrate, and at least one substrate conductor extending from the front side to the backside.
Journal ArticleDOI
A Cavity Chip Interconnection Technology for Thick MEMS Chip Integration in MEMS-LSI Multichip Module
TL;DR: In this paper, a cavity chip interconnection technology for thick microelectromechanical systems (MEMS) chip integration is developed. But the cavity chip is not suitable for the high step height of a few hundred micrometers without changing the circuit design of MEMS chip and complicated extra process.
Related Papers (5)
Novel interconnection technology for heterogeneous integration of MEMS–LSI multi-chip module
Kang-Wook Lee,Mitsumasa Koyanagi +1 more