Journal ArticleDOI
High density nano-scale twins in Cu induced by dynamic plastic deformation
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TLDR
In this paper, the nano-twinned bulk Cu specimens with a high density of nano-scale mechanical twins were produced by means of dynamic plastic deformation at liquid nitrogen temperature.About:
This article is published in Scripta Materialia.The article was published on 2005-09-01. It has received 199 citations till now. The article focuses on the topics: Ultimate tensile strength & Ductility.read more
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Deformation twinning in nanocrystalline materials
TL;DR: In this paper, a review of deformation twinning in nanocrystalline materials is presented, including deformation twins observed by molecular dynamics simulations and experiments, twinning mechanisms, factors affecting the twinning, analytical models on the nucleation and growth of deformations, interactions between twins and dislocations, and the effects of twins on mechanical and other properties.
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Microstructural evolution and nanostructure formation in copper during dynamic plastic deformation at cryogenic temperatures
Yusheng Li,Nairong Tao,Kathy Lu +2 more
TL;DR: In this article, the microstructural evolution and formation mechanism of nanostructures in bulk pure Cu samples induced by dynamic plastic deformation at high strain rates and cryogenic temperatures were investigated using transmission electron microscopic characterization.
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Plastic strain-induced grain refinement at the nanometer scale in copper
TL;DR: In this article, two different mechanisms for plastic strain-induced grain refinement in pure Cu were identified, corresponding to different levels of strain rate, and the minimum size of refined grains via this process is about 100 nm.
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Growth Twins and Deformation Twins in Metals
TL;DR: In this article, a review of recent basic research on two classes of twins: growth twins and deformation twins is presented, focusing primarily on studies that aim to understand, via experiments, modeling, or both, the causes and effects of twinning at a fundamental level.
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Effect of the Zener-Hollomon parameter on the microstructures and mechanical properties of Cu subjected to plastic deformation
TL;DR: In this paper, the effect of Zener Hollomon parameters (Z) on pure Cu microstructures and mechanical properties was investigated, and it was found that deformation twinning occurs when InZ exceeds 30 and the number of twins increases at higher Z.
References
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Journal ArticleDOI
Ultrahigh strength and high electrical conductivity in copper
TL;DR: Pure copper samples with a high density of nanoscale growth twins are synthesized and show a tensile strength about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper.
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High tensile ductility in a nanostructured metal.
TL;DR: A thermomechanical treatment of Cu is described that results in a bimodal grain size distribution, with micrometre-sized grains embedded inside a matrix of nanocrystalline and ultrafine (<300 nm) grains, which impart high strength, as expected from an extrapolation of the Hall–Petch relationship.
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Softening of nanocrystalline metals at very small grain sizes
TL;DR: In this paper, the deformation of nanocrystalline copper has been studied and it is shown that the hardness and yield stress of the material typically increase with decreasing grain size, a phenomenon known as the reverse Hall-Petch effect.
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Elastic and tensile behavior of nanocrystalline copper and palladium
TL;DR: The elastic and tensile behavior of high-density, high-purity nanocrystalline Cu and Pd was determined in this paper, showing that porosity increases with decreasing porosity, and may be significantly affected by a few large processing flaws.
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Tensile properties of copper with nano-scale twins
TL;DR: In this article, an electrodeposited Cu sample with a high density of nano-scale growth twins showed an ultrahigh tensile strength (similar to 1 GPa) with a considerable plastic strain (> 13%).