Journal ArticleDOI
Investigation of PCM-assisted heat pipe for electronic cooling
TLDR
In this paper, a horizontal phase change material (PCM)-assisted heat pipe system for electronic cooling was introduced as a potential solution to this problem and a computational fluid dynamic model was developed and validated to assist the investigation.About:
This article is published in Applied Thermal Engineering.The article was published on 2017-12-25. It has received 129 citations till now. The article focuses on the topics: Micro-loop heat pipe & Passive cooling.read more
Citations
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A new concept of thermal management system in Li-ion battery using air cooling and heat pipe for electric vehicles
Hamidreza Behi,Danial Karimi,Mohammadreza Behi,Mohammadreza Behi,Morteza Ghanbarpour,Joris Jaguemont,Mohsen Akbarzadeh Sokkeh,Foad H. Gandoman,Maitane Berecibar,Joeri Van Mierlo +9 more
TL;DR: In this paper, a hybrid thermal management system (TMS) including air cooling and heat pipe for electric vehicles (EVs) is presented, which can reduce the module temperature compared with natural air cooling by up to 34.5%, 42.1%, and 42.7% respectively.
Journal ArticleDOI
A review on pulsating heat pipes: From solar to cryogenic applications
Mohammad Alhuyi Nazari,Mohammad Hossein Ahmadi,Roghayeh Ghasempour,Mohammad Behshad Shafii,Omid Mahian,Omid Mahian,Soteris A. Kalogirou,Somchai Wongwises +7 more
TL;DR: Pulsating heat pipes (PHPs) are compact cooling equipment used for various applications, such as renewable energy systems, cooling electronic devices, heat recovery systems and many other applications as discussed by the authors.
Journal ArticleDOI
Experimental investigation on paraffin wax integrated with copper foam based heat sinks for electronic components thermal cooling
TL;DR: In this paper, the performance of heat sinks filled with phase change material (PCM) was investigated under a heat load of 8 to 24 W. The results revealed that base temperature of the heat sink is reduced as the volume fraction of PCM is increased.
Journal ArticleDOI
Thermal management of electronic devices using pin-fin based cascade microencapsulated PCM/expanded graphite composite
TL;DR: In this article, a numerical study was carried out through 3D lattice Boltzmann method with respect to different pin-fin configurations, expanded graphite (EG) content, PCM melting temperature, and heat flux conditions.
Journal ArticleDOI
Investigation of the effect of inclination angle on the melting enhancement of phase change material in finned latent heat thermal storage units
Ramin Karami,Babak Kamkari +1 more
TL;DR: In this article, the effect of the inclination angle of finned enclosures on the development of buoyancy-driven convection flows is investigated, and the results showed that the melting time reduces by decreasing the inclination angles of the enclosure due to the intensification of the natural convection flow and increase in the number of vortices in the liquid PCM.
References
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Numerical simulation of cylindrical heat pipe considering non-Darcian transport for liquid flow inside wick and mass flow rate at liquid–vapor interface
TL;DR: In this article, a copper cylindrical heat pipe simulation was carried out assuming steady state laminar flow, incompressible flow in liquid-wick and ideal gas incompressibly flow in vapor section in three dimensions to estimate the temperature, pressure and velocity profiles.