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Journal ArticleDOI

Low loss dielectric materials for LTCC applications: a review

Mailadil Thomas Sebastian, +1 more
- 01 Mar 2008 - 
- Vol. 53, Iss: 2, pp 57-90
TLDR
In this paper, the authors present a review of low temperature co-fired ceramic (LTCC) technologies for high frequency applications, which will be of immense help to researchers and technologists all over the world.
Abstract
Small, light weight and multifunctional electronic components are attracting much attention because of the rapid growth of the wireless communication systems and microwave products in the consumer electronic market. The component manufacturers are thus forced to search for new advanced integration, packaging and interconnection technologies. One solution is the low temperature cofired ceramic (LTCC) technology enabling fabrication of three-dimensional ceramic modules with low dielectric loss and embedded silver electrodes. During the past 15 years, a large number of new dielectric LTCCs for high frequency applications have been developed. About 1000 papers were published and ∼500 patents were filed in the area of LTCC and related technologies. However, the data of these several very useful materials are scattered. The main purpose of this review is to bring the data and science of these materials together, which will be of immense help to researchers and technologists all over the world. The comme...

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Citations
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Journal ArticleDOI

Homogeneous/Inhomogeneous-Structured Dielectrics and their Energy-Storage Performances.

TL;DR: The optimization of high-energy-storage dielectrics will have far-reaching impacts on the sustainable energy and will be an important research topic in the near future.
Journal ArticleDOI

Low-loss dielectric ceramic materials and their properties

TL;DR: In this paper, the data for all reported low-loss microwave dielectric ceramic materials are collected and tabulated and the table of these materials gives the relative permittivity, quality factor, temperature variation of the resonant frequency, crystal structure, sintering temperature, measurement
Journal ArticleDOI

High permittivity and low loss microwave dielectrics suitable for 5G resonators and low temperature co-fired ceramic architecture

TL;DR: In this article, a single Bi2(Li0.5Ta1.5)O7 + xBi2O3 (x = 0, 0.01 and 0.02) ceramics were prepared using a solid state reaction method.
Journal ArticleDOI

Low temperature co-fired ceramics with ultra-low sintering temperature: A review

TL;DR: In this article, the data for all reported low-loss microwave dielectric ceramic materials with ultra-low sintering temperatures are collected and tabulated, and the table of these materials gives the relative permittivity, quality factor (tan ǫ ), temperature variation of the resonant frequency, crystal structure, sinting temperature, measurement frequency and references.
Journal ArticleDOI

Microwave Dielectric Properties of Li2WO4 Ceramic with Ultra-Low Sintering Temperature

TL;DR: Li2WO4 with the phenacite structure has been shown to be chemically compatible with both silver and aluminum powders at 640°C and 660°C, respectively.
References
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Advances in Ceramics

Book

Liquid phase sintering

TL;DR: The use of liquid phase sintering has received increased attention as part of the growth in particulate materials processing as mentioned in this paper, which is attributed to an increased concern over energy utilization, a desire to better control microstructure in engineermg materials, the need for 1mproved material economy, societal and economic pressures for higher productivity and quality, requirements for unique property combinations for high performance applica- tions, and a desire for net shape forming.
Journal ArticleDOI

Densification during Sintering in the Presence of a Liquid Phase. I. Theory

TL;DR: In this paper, the driving force leading to densification during sintering in the presence of a liquid phase and the material transport phenomena have been analyzed and relationships for the densification rate during the rearrangement process, the solution-precipitation process, and the final coalescence process have been determined.
Journal ArticleDOI

Ceramic and Glass‐Ceramic Packaging in the 1990s

TL;DR: In this paper, a broad overview of packaging involving interconnecting, powering, protecting, and cooling semiconductor chips to meet a variety of computer system needs is presented, both for high-performance and low-performance applications.
Book

High-Speed Digital System Design: A Handbook of Interconnect Theory and Design Practices

TL;DR: This book provides a much-needed, practical guide to the state of the art of modern digital system design, combining easily accessible explanations with immensely useful problem-solving strategies.
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