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Journal ArticleDOI

Low pressure acoustic sensors for airborne sound with piezoresistive monocrystalline silicon and electrochemically etched diaphragms

TLDR
In this paper, an acoustic silicon sensor for airborne sound, which is based on boron-implanted monocrystalline piezoresistors located on an electrochemically etched silicon diaphragm, is presented.
Abstract
In this paper experimental results and theoretical considerations of an acoustic silicon sensor for airborne sound, which is based on boron-implanted monocrystalline piezoresistors located on an electrochemically etched silicon diaphragm, are presented. The bandwidth of the sensor is nearly 20 kHz (full audio bandwidth), a maximum sensitivity of 80 μV Pa −1 (bias voltage, 8 V) was achieved and a lowest equivalent noise level of about 61 dB(A) was measured. The membrane thickness is about 1.3 μm; the membrane area amounts to 1 mm 2 . Furthermore, a good reproducibility and linearity could be obtained. The weak sensitivity can mainly be explained by a residual inherent tensile stress in the silicon-silicon dioxide-silicon nitride layer system of the diaphragm and by the large geometric dimensions of the resistors.

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Citations
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Journal ArticleDOI

Micromachined pressure sensors: review and recent developments

TL;DR: In this paper, the authors reviewed the history of micromachined pressure sensors and examined new developments in the field of pressure sensors, starting from metal diaphragm sensors with bonded silicon strain gauges, and moving to present developments of surface-micromachines, optical, resonant, and smart pressure sensors.
PatentDOI

MEMS based acoustic array

TL;DR: In this paper, a combination responsive to an acoustic wave that can be utilized as a dynamic pressure sensor is described and shown in the specification and drawings, where the amplifier is spaced from the microphone with a separation smaller than 0.5 mm.
Proceedings ArticleDOI

A MEMS microphone for aeroacoustics measurements

TL;DR: In this paper, a siliconmicromachined, piezoresistive microphone for aero-austics measurements is presented, which consists of four dielectrically-isolated, single-crystal siliconPiezoresistors on top of a 1500 A-thick, 210 pm-diameter silicon-nitride membrane.
Journal ArticleDOI

Design and Fabrication of a Lead Zirconate Titanate (PZT) Thin Film Acoustic Sensor

TL;DR: In this article, a piezoelectric actuator was used for structural support and a circular clamped membrane consisting of a dielectric and a PZT actuator has been fabricated on a silicon wafer.
Journal ArticleDOI

Acoustic analysis and fabrication of microelectromechanical system capacitive microphones

TL;DR: In this article, a microelectromechanical system (MEMS) capacitive microphone fabricated by using a combination of surface and bulk micromachining techniques equipped with favorable integrated complementary metal-oxide semiconductor capability is presented.
References
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Journal ArticleDOI

The buckling and frequency of flexural vibration of rectangular isotropic and orthotropic plates using rayleigh's method

TL;DR: In this paper, a simple approximate formula for the natural frequencies of flexural vibration of isotropic plates, originally developed by Warburton using characteristic beam functions in Rayleigh's method, is modified to apply to specially orthotropic plates and extended to include the effect of uniform, direct inplane forces.
Journal ArticleDOI

A subminiature condenser microphone with silicon nitride membrane and silicon back plate

TL;DR: In this article, the fabrication process and properties of a capacitive silicon sensor for the detection of airborne sound are described, which consists of two chips; one chip carries a 150nm-thick silicon nitride membrane of 0.8×0.8 mm2, and the second chip represents a complete back plate including the back electrode and the air gap spacer.
Journal ArticleDOI

A silicon subminiature microphone based on piezoresistive polysilicon strain gauges

TL;DR: In this paper, a silicon subminiature microphone based on the piezoresistive effect in polysilicon using only one chip is proposed, which is fabricated by a technique that is compatible with a slightly modified CMOS process also using a standard micromechanical fabrication technology.
Journal ArticleDOI

A silicon condenser microphone with a silicon nitride diaphragm and backplate

TL;DR: In this paper, a new condenser microphone design can be fabricated using the sacrificial layer technique, which can be used to achieve a flat frequency response between 100 Hz and 14 kHz and a sensitivity of about 2 mV Pa-1 using a bias voltage of 16 V.
PatentDOI

Piezoresistive semiconductor microphone

TL;DR: In this paper, a germanium rod microphone with a cantilever beam arrangement was designed and constructed with a bridge type circuit and biased with 9 and 18 milliamperes.
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