Journal ArticleDOI
Measurement of adherence of residually stressed thin films by indentation. I. Mechanics of interface delamination
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TLDR
In this article, a fracture analysis of indentation-induced delamination of thin films is presented based on a model system in which the section of film above the delaminating crack is treated as a rigidly clamped disc, and the crack extension force is derived from changes in strain energy of the system as the crack extends.Abstract:
A fracture analysis of indentation‐induced delamination of thin films is presented. The analysis is based on a model system in which the section of film above the delaminating crack is treated as a rigidly clamped disc, and the crack extension force is derived from changes in strain energy of the system as the crack extends. Residual deposition stresses influence the cracking response by inducing buckling of the film above the crack and by providing an additional crack driving force once buckling occurs. A relation for the equilibrium crack length is derived in terms of the indenter load and geometry, the film thickness and mechanical properties, the residual stress level, and the fracture toughness of the interface. The analysis provides a basis for using controlled indentation cracking as a quantitative measure of interface toughness and for evaluating contact‐induced damage in thin films.read more
Citations
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Journal ArticleDOI
Interfacial toughness measurements for thin films on substrates
TL;DR: There are more than 200 different methods for measuring thin film adhesion, suggesting it to be material, geometry and even industry specific as discussed by the authors, suggesting that the major extrinsic variables are film stress, extent of delamination, thickness and temperature while the major intrinsic ones are modulus, yield strength, the thermodynamic work of adhesion and one or more length scales.
Journal ArticleDOI
Nanomechanical characterisation of solid surfaces and thin films
Bharat Bhushan,Xiaodong Li +1 more
TL;DR: An overview of various nanoindentation techniques, various measurement options, and data analysis is presented in this article, where data on elastic-plastic deformation behavior, hardness, elastic modulus, scratch resistance, film-substrate adhesion, residual stresses, time-dependent creep and relaxation properties, fracture toughness, and fatigue are presented.
Journal ArticleDOI
Fracture Mechanisms of Thin Amorphous Carbon Films in Nanoindentation
TL;DR: In this paper, the nanoindentation fracture of amorphous carbon films on silicon substrate was studied and the fracture process was found to progress in three stages: (1) first ring-like through-thickness cracks form around the indenter by high stresses in the contact area; (2) delamination and buckling occur around the contact areas at the film/substrate interface by high lateral pressure; and (3) second ring-wise through-thinness cracks and spalling are generated by high bending stresses at the edges of the buck led film.
Journal ArticleDOI
Fracture toughness, adhesion and mechanical properties of low-K dielectric thin films measured by nanoindentation
TL;DR: A cube corner indentation method was used to measure the fracture toughness of organo-silicate glass (OSG) films, which ranges from 0.01 to 0.05 MPaOm.
Patent
Glass-based soi structures
TL;DR: Semiconductor-on-insulator (SOI) structures, including large area SOI structures, are provided which have one or more regions composed of a layer (15) of a substantially single-crystal semiconductor (e.g., doped silicon) attached to a support substrate (20) composed of oxide glass or an oxide glass-ceramic as discussed by the authors.
References
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Book
The mathematical theory of plasticity
TL;DR: In this paper, the solution of two-dimensional non-steady motion problems in two dimensions is studied. But the solution is not a solution to the problem in three dimensions.
Book
Fracture of Brittle Solids
TL;DR: In this article, the authors present a unified continuum, microstructural and atomistic treatment of modern day fracture mechanics from a materials perspective, focusing on the basic elements of bonding and microstructure that govern the intrinsic toughness of ceramics.
Book
Thin-film optical filters
TL;DR: In this paper, the authors present a theoretical analysis of thin-film dielectric materials and apply it to filter and coating applications, showing that layer uniformity and thickness monitoring are important factors affecting layer and coating properties.
Journal ArticleDOI
On the mechanics of delamination and spalling in compressed films
TL;DR: In this paper, the authors used a combination of fracture mechanics and post-buckling theory to analyze the mechanics of delamination and spelling of pre-compressed films and indented coatings.
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