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Journal ArticleDOI

Measurements of bandgap narrowing in Si bipolar transistors

Jan W. Slotboom, +1 more
- 01 Oct 1976 - 
- Vol. 19, Iss: 10, pp 857-862
TLDR
In this paper, the authors used optical absorption measurements on uniformly doped silicon samples to determine the bandgap in silicon and used the bipolar transistor itself as the vehicle for measuring the band gap in the base.
Abstract
Theory predicts appreciable bandgap narrowing in silicon for impurity concentrations greater than about 1017 cm−3. This effect influences strongly the electrical behaviour of silicon devices, particularly the minority carrier charge storage and the minority carrier current flow in heavily doped regions. The few experimental data known are from optical absorption measurements on uniformly doped silicon samples. New experiments in order to determine the bandgap in silicon are described here. The bipolar transistor itself is used as the vehicle for measuring the bandgap in the base. Results giving the bandgap narrowing (ΔVg0) as a function of the impurity concentration (N) in the base (in the range of 4.1015–2.5 1019 cm−3) are discussed. The experimental values of ΔVg0 as a function of N can be fitted by: δV g0 = V 1 ln N N 0 + ln 2 N N 0 +C where V1, N0 and C are constants. It is also shown how the effective intrinsic carrier concentration (nie) is related with the bandgap narrowing (ΔVg0).

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Fundamentals of Modern VLSI Devices

Yuan Taur, +1 more
TL;DR: In this article, the authors highlight the intricate interdependencies and subtle tradeoffs between various practically important device parameters, and also provide an in-depth discussion of device scaling and scaling limits of CMOS and bipolar devices.
Journal ArticleDOI

Heterostructure bipolar transistors and integrated circuits

TL;DR: In this paper, the authors propose an inverted transistor strucure with a smaller collectors on top and a larger emitter on the bottom, with speed advantages over the common "emitter-up" design.
Journal ArticleDOI

A simple expression for band gap narrowing (BGN) in heavily doped Si, Ge, GaAs and GexSi1−x strained layers

TL;DR: In this article, the authors presented simple but accurate closed form equations for band gap narrowing (BGN) for n and p type, Si, Ge, GaAs and GexSi1−x alloys and strained layers.
Journal ArticleDOI

A precision curvature-compensated CMOS bandgap reference

TL;DR: In this article, a precision curvature-compensated switched-capacitor bandgap reference is described which uses a standard digital CMOS process and achieves temperature stability significantly lower than has previously been reported for CMOS circuits.
References
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Journal ArticleDOI

Resistivity of bulk silicon and of diffused layers in silicon

TL;DR: In this paper, the resistivity and impurity concentration in heavily doped silicon are reported and incorporated in a graph showing the resistivities (at T = 300°K) of n-and p-type silicon as a function of donor or acceptor concentration.
Journal ArticleDOI

Transport equations in heavily doped silicon, and the current gain of a bipolar transistor

TL;DR: In this paper, the Fermi level and effective density of states were calculated for heavily doped silicon, using methods similar to those of Kleppinger and Lindholm and Van Overstraeten et al.