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Proceedings ArticleDOI

Miniature RF MEMS metal-contact switches for DC-20 GHz applications

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TLDR
In this paper, the authors presented the design and measurements of a miniature RF MEMS (Micro-Electro-Mechanical System) metal-contact switch, which is robust to stress effects (residual and stress gradients) which increases its yield on large wafers.
Abstract
This paper presents the design and measurements of a miniature RF MEMS (Micro-Electro-Mechanical System) metal-contact switch. The dimensions (25×24×1.6 µm) and shape of the beam and actuation pad have been optimized to result in a 12–25 µN contact force at 52–60 V actuation, with a corresponding restoring force of 15 µN. Measured S-parameters on a single switch show an up-state capacitance of 5 fF and a 13–14 Ω contact resistance for a Au-Ru contact under an actuation voltage of 55 V. In order to reduce the effective switch resistance, 10 miniature RF MEMS switches have been placed in parallel and result in an up-state capacitance of 30 fF and a switch resistance of 1.4 Ω. The measured switching time is 2.2 µs and the release time is < 1 µs. The switch is robust to stress effects (residual and stress gradients) which increases its yield on large wafers. To our knowledge, this is the first demonstration of a miniature RF-MEMS metal-contact switch and with an excellent figure-of-merit (f c =1/(2.π.R on. C u )=3.8 THz).

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Citations
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Journal ArticleDOI

Miniature MEMS Switches for RF Applications

TL;DR: In this article, a new way to design MEMS (microelectromechanical system) metal contact switches for RF applications using miniature MEMS cantilevers was presented, and a single 25 × 25 μm switch was first demonstrated with a Au-to-Ru contact, Cu = 5 fF and Ron = 7 Ω at an actuation voltage of 55 V. The measured switching time is 2.2 μs and the release time is <;1 μs.
Journal ArticleDOI

Vanadium Oxide Thin-Film Variable Resistor-Based RF Switches

TL;DR: In this article, a series single-pole single-throw (SPST) switches with integrated VO2 thin films were designed, fabricated, and tested, and the overall size of the device is $380~\mu \text{m}times 600~ Âmu  m$.
Proceedings ArticleDOI

Substrate agnostic monolithic integration of the inline phase-change switch technology

TL;DR: Omni-directional GeTe inline phase-change switches (IPCS) have been fabricated and heterogeneously integrated with commercial SiGe BiCMOS technology to create a reconfigurable receiver as discussed by the authors.
Proceedings ArticleDOI

Low Loss, High Performance 1-18 GHz SPDT Based on the Novel Super-Lattice Castellated Field Effect Transistor (SLCFET)

TL;DR: In this article, a low loss, high isolation, broadband RF switch was developed using a novel type of field effect transistor structure that exploits the use of a super-lattice structure in combination with a three dimensional, castellated gate to achieve excellent RF switch performance.
References
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Journal ArticleDOI

Lifetime Measurements on a High-Reliability RF-MEMS Contact Switch

TL;DR: In this paper, the mean cycles-to-failure measured on an ensemble of switches was 430 billion switch cycles and the longest lifetime exhibited without degradation of the switch was 914 billion cycles.
Journal ArticleDOI

High-Reliability Miniature RF-MEMS Switched Capacitors

TL;DR: In this article, the authors presented a radical departure from the standard RF microelectromechanical systems (MEMS) devices and introduced novel miniature MEMS switched capacitors for RF to millimeter-wave applications, which are around 150 times smaller in lateral dimensions than standard MEMS designs.
Proceedings ArticleDOI

Development of SPDT-structured RF MEMS switch

TL;DR: In this article, a single pole double throw (SPDT)-structured radio frequency microelectromechanical system (RF MEMS) switch for RF applications is proposed, which has a very low insertion loss of 1.0dB and a high isolation of 40dB, up to 10GHz.
Proceedings ArticleDOI

Parallel-contact metal-contact RF-MEMS switches for high power applications

TL;DR: In this article, a metal-contact MEMS switch element with a relatively wide and thick cantilever having two contacts was designed and tested with the aim of handling moderately high RF power (hundreds of mW to 1 W).
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