Journal ArticleDOI
Modelling and analysis of semiconductor manufacturing in a shrinking world: challenges and successes
Chen-Fu Chien,Stéphane Dauzère-Pérès,Hans Ehm,John W. Fowler,Zhibin Jiang,Shekar Krishnaswamy,Tae-Eog Lee,Lars Mönch,Reha Uzsoy +8 more
TLDR
A panel session on the role of modeling and analysis in semiconductor manufacturing in a shrinking world is presented with participants from Asia, Europe, and US and there are two panel organizers/ moderators.Abstract:
This paper presents a brief overview of semiconductor manufacturing followed by the results of a panel session held at the Fourth International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) in Miami, December 10, 2008 on the role of modelling and analysis in semiconductor manufacturing in a shrinking world. Three participants are from Asia, two from Europe, and two from the USA in addition to the two panel organisers (Fowler and Monch). At least one panellist from each continent is from industry and one from academia. The statements of the panellists from industry relate to modelling and analysis problems found in their own companies. Those of the academic panellists describe the role that modelling and analysis has played and is expected to play in their semiconductor manufacturing research. Their views on the challenges and successes of modelling and analysis in a globalised world are also included. Finally, we identify some future research challenges for semiconductor manufa...read more
Citations
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Journal ArticleDOI
A survey of semiconductor supply chain models part I: semiconductor supply chains, strategic network design, and supply chain simulation
TL;DR: The structure of semiconductor supply chains is described to provide context for the research efforts, and a classification scheme for the relevant literature is proposed.
Journal ArticleDOI
An intelligent system for wafer bin map defect diagnosis: An empirical study for semiconductor manufacturing
C. M. Liu,Chen-Fu Chien +1 more
TL;DR: The proposed WBM intelligent system can recognize specific failure patterns efficiently and also record the assignable root causes verified by the domain experts to enhance troubleshooting effectively.
Journal ArticleDOI
Analysing semiconductor manufacturing big data for root cause detection of excursion for yield enhancement
TL;DR: The proposed approach has shown practical viability to efficiently detect possible root causes of excursion to reduce the trouble shooting time and improve the production yield effectively.
Journal ArticleDOI
A Framework for Root Cause Detection of Sub-Batch Processing System for Semiconductor Manufacturing Big Data Analytics
Chen-Fu Chien,Shih-Chung Chuang +1 more
TL;DR: In this paper, a root cause detection framework for the sub-batch processing system is proposed for semiconductor manufacturing, which consists of three phases: data preparation, data dimension reduction, and the subbatch processing model construction and evaluation.
Journal ArticleDOI
A Multiobjective Hybrid Genetic Algorithm for TFT-LCD Module Assembly Scheduling
TL;DR: A multiobjective hybrid genetic algorithm (MO-HGA) is developed that hybridizes with the variable neighborhood descent (VND) algorithm as a local search and TOPSIS evaluation technique to derive the best compromised solution to address the TFT-LCD module assembly scheduling problem.
References
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