Journal ArticleDOI
Numerical and Experimental Investigation of Microchip Encapsulation
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In this paper, a numerical simulation of moving boundaries in a two-dimensional, inertia-free, incompressible flow with shear-thinning viscosity is presented.Abstract:
A numerical simulation of moving boundaries in a two-dimensional, inertia-free, incompressible flow with shear-thinning viscosity is presented. A control-volume approach with fixed finite-element mesh is used for predicting the fluid-front advancement. The experimental results for nine different configurations of upper- and lower-cavity thickness in a flow domain similar to the mold cavity used for microchip encapsulation are reported. The predicted fluid-front advancement and pressure are found to be in good agreement with the corresponding experimental measurements. The difference in pressure on two sides of the paddle is used to develop an analytical model for predicting the paddle shift during microchip encapsulation.read more
Citations
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Journal ArticleDOI
Investigation of the fluid/structure interaction phenomenon in IC packaging
TL;DR: The virtual modelling technique was proven to be excellent in handling the visualisation of FSI phenomenon in the actual package due to limitations of package size, available equipment, and the high cost of the experimental setup.
Journal ArticleDOI
Three‐dimensional simulation of microchip encapsulation process
TL;DR: In this article, a finite element simulation of moving boundaries in a three-dimensional inertia-free, incompressible flow is presented to predict fluid front advancement and pressure variation in a flow domain similar to the mold cavity used for microchip encapsulation.
Journal ArticleDOI
Stabilized filling simulation of microchip encapsulation process
TL;DR: In this article, a stabilized filling simulation method of microchip encapsulation process is presented, where the non-isothermal and incompressible N-S equations coupled with the Kamal curing equation is introduced in as governing equations, and the Castro-Macosko model is employed as the constitutive model of the epoxy molding compound (EMC).
Journal ArticleDOI
FEM and BEM in electronic packaging A bibliography (1998-1999)
TL;DR: In this article, a bibliography contains references to papers, conference proceedings and theses/dissertations dealing with the implementation of ''nite element and boundary element methods in electronic packaging that were published in 1998}1999.
Journal ArticleDOI
Development of measurement system for die-pad behavior in IC encapsulation process using Hall elements
TL;DR: In this article, the authors measured the die-pad behavior along both the height and rotational directions during the melt filling and curing process using Hall elements and a permanent magnet, and the results showed that the diepad moved more when the transfer time was longer.
References
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Journal ArticleDOI
A finite-element/finite-difference simulation of the injection-molding filling process
C.A. Hieber,S.F. Shen +1 more
TL;DR: In this article, a detailed formulation for simulating the injection-molding filling of thin cavities of arbitrary planar geometry is presented, in terms of generalized Hele-Shaw flow for an inelastic, non-Newtonian fluid under non-isothermal conditions.
Journal ArticleDOI
Dynamic simulation and graphics for the injection molding of three-dimensional thin parts
V.W. Wang,C.A. Hieber,K. K. Wang +2 more
TL;DR: In this paper, a numerical formulation is presented for simulating the injection-molding filling of thin cavities, together with the delivery system, in 3D. The modeling is based on generalized Hele-Shaw flow for an inelastic, non-Newtonian fluid under non-isothermal conditions.
Journal ArticleDOI
Wire bond behavior during molding operations of electronic packages
TL;DR: In this paper, the behavior of wire bonds during a typical transfer molding operation is modeled and a low drag coefficient is obtained if some measure of control on the shape of the wire (e.g. angle of orientation of the wires with respect to the flow) is exerted.
Journal ArticleDOI
A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments
Sejin Han,K. K. Wang +1 more
TL;DR: In this paper, a step-by-step approach has been used considering one factor at a time to predict wire sweep during semiconductor chip encapsulation with transfer molding, and the effect of bubble on the wire sweep has been analyzed qualitatively.
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