Journal ArticleDOI
Plasma immersion ion implantation—a fledgling technique for semiconductor processing
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TLDR
Plasma immersion ion implantation (PIII) is a cluster compatible doping and processing tool offering many inherent advantages over conventional beamline ion implantations as discussed by the authors, such as the formation of shallow junction, synthesis of silicon-on-insulator, large area implantation, trench doping, conformal deposition and so on.Abstract:
Plasma immersion ion implantation (PIII) is a cluster compatible doping and processing tool offering many inherent advantages over conventional beamline ion implantation. When first introduced in the late 1980s, the technique was primarily used to enhance the surface mechanical properties of metals. Recently, a substantial amount of research activities have focused on microelectronics and have led to a number of very interesting applications, such as the formation of shallow junction, synthesis of silicon-on-insulator, large area implantation, trench doping, conformal deposition, and so on. In this paper, we will review the principles of PIII, the dynamic sheath model for various kinds of plasma, reactor designs, recent applications in the area of microelectronics, as well as the future of PIII pertaining to semiconductor materials and processing.read more
Citations
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Particle-in-Cell Charged Particle Simulations, plus Monte Carlo Collisions with Neutral Atoms, PIC-MCC
TL;DR: In this article, particle-in-cell (PIC) combined with Monte Carlo collision (MCC) calculations are used for simulation of partially ionized gases, with many of the features met in low-temperature collision plasmas.
Patent
Method of producing a thin layer of semiconductor material
TL;DR: In this paper, a method of producing the thin layer of semiconductor material includes implanting ions into the semiconductor wafer to define a reference plane, where the ion dose is above a minimum dose, but below a critical dose so as to avoid degrading the wafer surface.
Patent
Controlled cleaving process
TL;DR: In this paper, an energy source is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate (10) at the selected depth (20), whereupon the cleaving activity provides an expanding cleave front to free the donor material from a remaining portion of the remaining portion.
Journal ArticleDOI
Radiation damage in nanostructured materials
Xinghang Zhang,Khalid Hattar,Youxing Chen,Lin Shao,Jin Li,Cheng Sun,Kaiyuan Yu,Nan Li,Mitra L. Taheri,Haiyan Wang,Jian Wang,Michael Nastasi +11 more
TL;DR: In this paper, the authors summarized and analyzed the current understandings on the influence of various types of internal defect sinks on reduction of radiation damage in primarily nanostructured metallic materials, and partially on nanoceramic materials.
Journal ArticleDOI
Surface energy, wettability, and blood compatibility phosphorus doped diamond-like carbon films
TL;DR: In this paper, a diamond-like carbon (DLC) film was fabricated by plasma immersion ion implantation and deposition (PIII and D) and the structure, physicochemical characteristics, electrical properties, as well as surface biomedical compatibility, were evaluated using different characterization techniques.
References
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J.P. Biersack,James F. Ziegler +1 more
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TL;DR: In this article, the authors presented a three-hour final exam on the theory of wave motion in a cold uniform plasma and showed that it can be viewed as a form of particle motion.