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Patent

Silicon carbide static induction transistor

TLDR
In this paper, a static induction transistor fabricated of silicon carbide polytype is presented, and a gate material is provided along the drift layer between the two protrusions and a conductive gate contact is provided upon the gate material.
Abstract
A static induction transistor fabricated of silicon carbide, preferably 6H polytype, although any silicon carbide polytype may be used. The preferred static induction transistor is the recessed Schottky barrier gate type. Thus, a silicon carbide substrate is provided. Then, a silicon carbide drift layer is provided upon the substrate, wherein the drift layer has two spaced-apart protrusions or fingers which extend away from the substrate. Each protrusion of the drift layer has a source region of silicon carbide provided thereon. A gate material is then provided along the drift layer between the two protrusions. A conductive gate contact is provided upon the gate material and a conductive source contact is provided upon each source region. A conductive drain contact is provided along the substrate. Other gate types for the static induction transistor are contemplated. For example, a planar Schottky barrier gate may be employed. Furthermore, recessed or planar MOS gates may be utilized, as may a PN junction gate.

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References
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Journal ArticleDOI

Thin film deposition and microelectronic and optoelectronic device fabrication and characterization in monocrystalline alpha and beta silicon carbide

TL;DR: The results of several research programs in the United States, Japan and the Soviet Union, and the remaining challenges related to the development of silicon carbide for microelectronics are presented and discussed in this article.
Journal ArticleDOI

The potential of diamond and SiC electronic devices for microwave and millimeter-wave power applications

TL;DR: The potential of SiC and diamond for producing microwave and millimeter-wave electronic devices is reviewed in this article, where it is shown that both of these materials possess characteristics that may permit RF electronic devices with performance similar to or greater than what is available from devices fabricated from the commonly used semiconductors, Si, GaAs, and InP.
Patent

Process for producing a SiC semiconductor device

TL;DR: In this article, a process for producing a SiC semiconductor device comprising growing a singlecrystal film of SiC on a single-crystal substrate of Si and forming the structure of semiconductor devices such as diodes, transistors, etc.
Patent

Schottky barrier type field effect transistor

D Shinoda, +1 more
TL;DR: In this article, the relationship between the thickness and impurity concentration of the gallium arsenide layer is given by the expression: 2 X 103CM 1/2 < W. square root N < 3 X 103 cm 1/ 2.