Surface Passivation of Crystalline and Polycrystalline Silicon Using Hydrogenated Amorphous Silicon Oxide Film

TLDR: In this paper, excellent passivation properties of hydrogenated amorphous silicon oxide (a-SiOx:H) prepared by very high frequency plasmaenhanced chemical vapor deposition (VHF PECVD) at a low substrate temperature (170 °C) on crystalline and polycrystalline silicon (Si) wafers are reported.

Abstract: Excellent passivation properties of hydrogenated amorphous silicon oxide (a-SiOx:H) prepared by very high frequency plasma-enhanced chemical vapor deposition (VHF PECVD) at a low substrate temperature (170 °C) on crystalline and polycrystalline silicon (Si) wafers are reported. Films were characterized by ellipsometry, Fourier transform infrared spectroscopy (FTIR), ultraviolet–visible (UV–vis) spectrophotometry, and dark-conductivity and photoconductivity measurements. A comparison of the results with those for different passivation layers such as hydrogenated amorphous silicon carbon nitride (a-SiCxNy:H), hydrogenated amorphous silicon nitride (a-SiNx:H), and hydrogenated amorphous silicon (a-Si:H) reveals their superiority as an excellent passivation layer for p-type crystalline Si as well as polycrystalline Si. A maximum effective lifetime of 400 µs was measured for 1–10 Ω cm, 380-µm-thick p-type c-Si using a micro-photocurrent decay (µ-PCD) system. Fixed charge density (Qf) was estimated by high-frequency (1 MHz) capacitance–voltage measurement using a metal–insulator–silicon structure (CV-MIS). The effect of annealing temperature on surface passivation in a nitrogen atmosphere was also studied.