Journal ArticleDOI
The Effects of Bath Composition on the Morphologies of Electroless Nickel Under-Bump Metallurgy on Al Input/ Output Pad
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TLDR
In this paper, the electroless nickel plating on an aluminum input/output (I/O) pad was investigated and the relationship between aluminum dissolution and the ratio of zinc and NaOH was investigated.Abstract:
The electroless nickel plating on an aluminum input/output (I/O) pad was investigated. The aluminum pad was pretreated in a zincate solution prior to electroless nickel plating. Zinc particles on the aluminum pad gave a good adherent nickel layer. The adhesion and uniformity of zinc on the aluminum is the key factor in under-bump metallurgy (UBM). The electrode potential changes with and without zinc ions in the bath were measured to analyze the sequence of two competing reactions: zinc deposit and hydrogen evolution. The relationship between aluminum dissolution and the ratio of zinc and NaOH was investigated. The electroless nickel deposition rate was dependent on bath composition. The effects of complexing ligand and additive on the nickel deposit were analyzed. Electrode potential changes were measured with time to confirm nucleation and grain growth. Adhesion of the UBM was related to zinc-particle dissolution and nickel nucleation. The uniform nickel UBM was fabricated on a real Al I/O pad.read more
Citations
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Journal ArticleDOI
Microstructural characteristics of immersion tin coatings on copper circuitries in circuit boards
TL;DR: In this paper, the characteristics of immersion tin coatings and the formation of tin whiskers and the intermetallic compound (IMC) are described, which is used as a lead-free surface finish.
Journal ArticleDOI
Nucleation and Growth of Zinc Particles on an Aluminum Substrate in a Zincate Process
TL;DR: The nucleation and growth of zinc particles during a conventional zincate process were investigated in this article, where it was found that zinc particles preferentially nucleated on the peak or edge of an aluminum surface and preferedly grew with the (0001) plane on hexagonal platelets, forming localized islands.
Journal ArticleDOI
Mechanisms overview of Thermocompression Process for Copper Metal Bonding
TL;DR: In this paper, a specific scenario inspired by both wafer and metal welding state of the art is put forward, where pure copper diffusion through the bonding interface is lined with plastic deformation and metallic oxide fracture.
Journal ArticleDOI
Direct silver to aluminum solid-state bonding processes
Shao-Wei Fu,Chin C. Lee +1 more
TL;DR: Ag-Al solid-state bonding has been developed as a novel bonding technique to bond Ag directly to Al substrates in this paper, where the effect of bonding temperatures on Ag-Al joint morphology and the fracture behaviors were investigated and discussed.
Journal ArticleDOI
New solid-state die-attach method using silver foil bonded on aluminum substrate by eutectic reaction
Shao-Wei Fu,Chin C. Lee +1 more
TL;DR: In this paper, a novel Ag foil bonding technique has been developed to bond Ag foils directly to Al substrates to produce Ag-cladded Al (Al2O3) substrates.
References
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Book
Electroless plating : fundamentals and applications
Glenn O. Mallory,Juan B. Hajdu +1 more
TL;DR: The Electroless Plating: Fundamentals and Applications (ESPA) as discussed by the authors is a comprehensive text that covers both fundamental and applied aspects of electroless deposition, and was first introduced at SUR/FIN '91.
Journal ArticleDOI
Double Zincate Pretreatment of Sputter-Deposited Al Films
TL;DR: In this article, the properties of double zincate pretreatment of thin Al films on glass plates using magnetron sputtering and ion-beam sputtering were investigated, and it was shown that the substitution reaction of Al dissolution and Zn deposition occurring on the ionbeam sputter-deposited film ceased during the first and the second zincate treatment processes.
Journal ArticleDOI
The role of iron(iii) and tartrate in the zincate immersion process for plating aluminium
S.G. Robertson,Ian M. Ritchie +1 more
TL;DR: In this article, a detailed investigation of the function of tartrate and ferric chloride in the zinc immersion process is presented. But it was found that the tartrate alone did not significantly affect the rate of zinc deposition, the deposit morphology or the position of the aluminium or zinc polarization curves.
Journal ArticleDOI
The morphologies and the chemical states of the multiple zincating deposits on Al pads of Si chips
Kwang-Lung Lin,Shiuh Yuan Chang +1 more
TL;DR: In this paper, a three-time multiple zincating process was used for silicon chips, and the results revealed that the surface of the as-deposited zincating layer was oxidized, while the intermediate acidic etching tended to eliminate the oxidized surface.