Journal ArticleDOI
The fracture resistance of a model metal/ceramic interface
TLDR
In this article, the Al2O3/Au interface has been measured for the first time subject to conditions that exclude stress corrosion, and it has been shown that crack growth occurs with a rising resistance governed by intact metal ligaments in the crack wake.Abstract:
Crack propagation has been measured for the Al2O3/Au interface subject to conditions that exclude stress corrosion. Crack growth has been shown to occur with a rising resistance, governed by intact metal ligaments in the crack wake. The level of resistance also increases as the metal layer thickness increases. Crack extension occurs by a combination of plastic void growth and interface debonding. The fracture energies are much larger than the work of adhesion, but appreciably smaller than those expected for ductile interface fracture. The fracture energy is nevertheless dominated by plastic dissipation, which increases at larger metal layer thicknesses.read more
Citations
More filters
Book ChapterDOI
Mixed mode cracking in layered materials
John W. Hutchinson,Zhigang Suo +1 more
TL;DR: In this article, the authors describe the mixed mode cracking in layered materials and elaborates some of the basic results on the characterization of crack tip fields and on the specification of interface toughness, showing that cracks in brittle, isotropic, homogeneous materials propagate such that pure mode I conditions are maintained at the crack tip.
Journal ArticleDOI
Residual Stresses in Thermal Spray Coatings and Their Effect on Interfacial Adhesion : A Review of Recent Work
T.W. Clyne,S. C. Gill +1 more
TL;DR: In this paper, the main experimental techniques for measurement of residual stresse are briefly described, with particular attention given to the method of continuous curvature monitoring, and relationships are presented between residual stresses and corresponding strain energy release rates during interfacial debonding.
Journal ArticleDOI
The thermomechanical integrity of thin films and multilayers
TL;DR: In this paper, the principles of fail-safe thermomechanical design, based on the damage mechanisms known to occur in these systems, are discussed, including delamination and crazing of brittle layers.
Journal ArticleDOI
Finite element analysis of thermal residual stresses at graded ceramic‐metal interfaces. Part I. Model description and geometrical effects
TL;DR: In this paper, an elastic-plastic finite element method numerical model has been formulated to study residual stresses developed at graded ceramic-metal interfaces during cooling, and the results were compared with those obtained for sharp (nongraded) interfaces to assess the potential for achieving residual stress reductions.
Journal ArticleDOI
On the toughness of ductile adhesive joints
TL;DR: In this article, Tvergaard and Hutchinson (1994) applied an embedded fracture zone model to the mode I fracture of an adhesive joint comprised of a thin elastic-plastic metal layer joining two elastic substrates.
References
More filters
Journal ArticleDOI
A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces
TL;DR: In this paper, a finite element approach has been used to characterize trends in the stress intensities and center point displacement with specimen dimensions, elastic properties, and crack length with finite element approaches.
Journal ArticleDOI
Finite deformation analysis of crack-tip opening in elastic-plastic materials and implications for fracture
TL;DR: In this article, a finite element method was used to analyze the deformation field around smoothly-blunting crack tips in both non-hardening and hardening elastic-plastic materials, under contained plane-strain yielding and subject to mode I opening loads.
Journal ArticleDOI
The strength and fracture of alumina bonded with aluminum alloys
TL;DR: In this paper, it has been shown that when the bond layer is thick, the bond strength is limited either by plastic flow or by ductile fracture in the metal, whereas when the layer is thin, failure occurs in the ceramic, limited by the strength of the ceramic.