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Journal ArticleDOI

Sandwich test specimens for measuring interface crack toughness

TLDR
In this article, a crack lying along one interface on an elastic sandwich structure is analyzed and a universal relation is found between the actual interface stress intensity factors at the crack tip and the apparent mode I and mode II stress intensity factor associated with the corresponding problem for the crack in the homogeneous material.
Abstract
A crack lying along one interface on an elastic sandwich structure is analyzed. When the thickness of the middle layer is small compared with the other length scales of the structure, a universal relation is found between the actual interface stress intensity factors at the crack tip and the apparent mode I and mode II stress intensity factors associated with the corresponding problem for the crack in the homogeneous material. Therefore, if the apparent stress intensity factors are known, for example calculated from the applied loads as if the structure was homogeneous, this information can be immediately converted into the interface stress intensity factors with the universal relation. This observation provides the theoretical basis for developing sandwich specimens for measuring interface crack toughness. The universal relation reveals the extent to which the asymmetry inherent to a bimaterial interface induces asymmetry in the near tip crack field. In particular, the result of the study can be used to infer whether stress intensity factors for a homogeneous body can be used with good approximation in place of the actual interface stress intensity factors. A proposal for simplifying the approach to interfacial fracture is made which plays down the role of the so-called oscillatory interface singularity stresses.

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Book ChapterDOI

Mixed mode cracking in layered materials

TL;DR: In this article, the authors describe the mixed mode cracking in layered materials and elaborates some of the basic results on the characterization of crack tip fields and on the specification of interface toughness, showing that cracks in brittle, isotropic, homogeneous materials propagate such that pure mode I conditions are maintained at the crack tip.
Journal ArticleDOI

Low dielectric constant materials for microelectronics

TL;DR: In this paper, a review of porosity in on-chip wires can be found, with an attempt to give an overview of the classification, the character, and the characteristics of the porosity.
Journal ArticleDOI

Adhesion and debonding of multi-layer thin film structures

TL;DR: In this paper, a fracture mechanics technique to quantitatively measure the adhesion or interfacial fracture resistance of interfaces in thin film structures is described, which is expected to have important implications for long term device reliability.
Journal ArticleDOI

Interfacial toughness measurements for thin films on substrates

TL;DR: There are more than 200 different methods for measuring thin film adhesion, suggesting it to be material, geometry and even industry specific as discussed by the authors, suggesting that the major extrinsic variables are film stress, extent of delamination, thickness and temperature while the major intrinsic ones are modulus, yield strength, the thermodynamic work of adhesion and one or more length scales.
Journal ArticleDOI

An analysis of tensile decohesion along an interface

TL;DR: In this paper, a COHESIVE zone type interface model is used to study the decohesion of a viscoplastic block from a rigid substrate, taking full account of finite geometry changes, and the specific boundary value problem analysed is one of plane strain tension with a superposed hydrostatic stress.
References
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Journal ArticleDOI

Interface crack between two elastic layers

TL;DR: In this article, a semi-infinite interface crack between two infinite isotropic elastic layers under general edge loading conditions is considered and the problem can be solved analytically except for a single real scalar independent of loading, which is then extracted from the numerical solution for one particular loading combination.
Journal ArticleDOI

A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces

TL;DR: In this paper, a finite element approach has been used to characterize trends in the stress intensities and center point displacement with specimen dimensions, elastic properties, and crack length with finite element approaches.
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