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Transient Energy Management Strategies for Portable Systems

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TLDR
In this paper, transient energy management strategies are introduced via examining chip-on-substrate geometry and evaluating transient thermal management case study on PowerPC based model notebook computer, where cascaded frequency reduction, periodic heating and workload shifting techniques for dynamically controlling chip junction temperature are discussed.
Abstract
Transient energy management strategies are introduced via examining chip-on-substrate geometry and evaluating transient thermal management case study on PowerPC based model notebook computer. Cascaded frequency reduction, periodic heating and workload shifting techniques for dynamically controlling chip junction temperature are discussed. Model notebook computer case study indicates that it is possible to improve notebook computer performance dramatically by using high end processor and transient thermal storage cooling techniques.

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References
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Book

Introduction to Heat Transfer

TL;DR: In this article, the physical concepts and methodologies of heat and mass transfer are explained for advanced undergraduate engineering majors, using a systematic method for problem solving and discusses the relationship of heat transfer to many important practical applications through examples and problems.
Journal ArticleDOI

Analysis of thermal transient data with synthesized dynamic models for semiconductor devices

J.W. Sofia
TL;DR: In this paper, a technique for synthesizing dynamic models comprised of discrete thermal resistances and capacitances directly from thermal step-response data on packaged semiconductor devices has been developed.
Journal ArticleDOI

An analysis of the thermal response of power chip packages

TL;DR: In this article, steady-state and transient analytic solutions for the axisymmetric, two-dimensional, and three-dimensional spreader geometries are presented for the thermal resistance of the base alone.
Journal ArticleDOI

Transient thermal study of semiconductor devices

TL;DR: In this article, an analytical three-dimensional transient temperature solution of a two-layer semi-infinite plate structure with embedded heat sources is discussed, where the thickness of the second layer is assumed to extend to infinity.
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