Patent
Ultraviolet laser system and method for forming vias in multi-layered targets
Mark D. Owen,James N. O'brien +1 more
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TLDR
In this paper, the output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light for forming vias (72, 74) in multi-layered targets (40).Abstract:
The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for forming vias (72, 74) in multi-layered targets (40). The parameters of the output pulses (62) are selected to facilitate substantially clean, simultaneous or sequential drilling or via formation in a wide variety of materials such as metals, organic dielectrics, and reinforcement materials having different thermal absorption characteristics in response to ultraviolet light. These parameters typically include at least two of the following criteria: high average power of greater than about 100 milliwatts measured over the beam spot area, a temporal pulse width shorter than about 100 nanoseconds, a spot diameter of less than about 50 microns, and a repetition rate of greater than about one kilohertz. The laser system (10) and method circumvent conventional depth of cut saturation limitations and can achieve an increased depth of cut per pulse in a target (40) formed of either single- or multi-layered material.read more
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Method of diced wafer transportation
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TL;DR: In this article, the authors described a method of dicing a wafer having a plurality of integrated circuits thereon, where the wafer was divided into a plurality and a water soluble material layer over and between the plurality of singulated dies, above the dicing tape.
Patent
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Patent
Laser beam scanning method for forming via holes in polymer materials
TL;DR: In this article, the surface of a polymer dielectric layer is scanned repeatedly with a high energy continuous wave laser in a pattern to create via holes of desired size, shape and depth.
Journal ArticleDOI
Spectroscopic and fast photographic studies of excimer laser polymer ablation
P. E. Dyer,J. Sidhu +1 more
TL;DR: The time dependence of the expansion for various environmental gas pressures has been studied in this way as discussed by the authors, showing that at low pressures (< 0.5 mb) the expansion approaches a free expansion into a vacuum, while at 15 mb the time dependence is close to that predicted by an ideal blast wave model, suggesting that a significant fraction of the luminous species detected spectroscopically may be created in the shock front at the plume/environmental gas interface.
Patent
Method of laser drilling fluoropolymer materials
TL;DR: In this article, a method of ablating fluoropolymer composition materials is presented wherein it has been found that small holes (less than 100 νm) can be formed in fluoropolymers composition laminate materials using UV lasers to direct laser light through a mask and focusing lens.
Patent
Method for forming vias in multilayer circuits
TL;DR: In this article, a method for rapidly forming a pattern of vias in multilayer electronic circuits in which each of the via holes is formed by drilling with a controlled number of Nd:YAG laser beam pulses is presented.
Journal ArticleDOI
Theory of polymer ablation
TL;DR: In this article, a new formula for the etch depth l per pulse of an excimer laser of fluence F was presented, and it was shown that l is proportional to F, rather than ln(F).
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