Patent
Ultraviolet laser system and method for forming vias in multi-layered targets
Mark D. Owen,James N. O'brien +1 more
Reads0
Chats0
TLDR
In this paper, the output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light for forming vias (72, 74) in multi-layered targets (40).Abstract:
The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for forming vias (72, 74) in multi-layered targets (40). The parameters of the output pulses (62) are selected to facilitate substantially clean, simultaneous or sequential drilling or via formation in a wide variety of materials such as metals, organic dielectrics, and reinforcement materials having different thermal absorption characteristics in response to ultraviolet light. These parameters typically include at least two of the following criteria: high average power of greater than about 100 milliwatts measured over the beam spot area, a temporal pulse width shorter than about 100 nanoseconds, a spot diameter of less than about 50 microns, and a repetition rate of greater than about one kilohertz. The laser system (10) and method circumvent conventional depth of cut saturation limitations and can achieve an increased depth of cut per pulse in a target (40) formed of either single- or multi-layered material.read more
Citations
More filters
Patent
Device for analysing a single pulse with variable step
Marc Cuzin,Marie Claude Gentet +1 more
TL;DR: In this article, a device for analysing a single electric pulse comprising an electric circuit consisting of a propagation line including optoelectronic switches consisting of photoconductive blocks, each of them being connected to a corresponding analysing line, and an optical device for lighting the switches with a laser beam, two neighbouring switches being lighted successively, not simultaneously.
Patent
Baking tool for improved wafer coating process
TL;DR: In this article, a method of dicing a semiconductor wafer including integrated circuits involves coating a surface of the semiconductor Wafer to form a mask covering the integrated circuits, and then patterning the mask with a laser scribing process to provide a patterned mask with gaps, exposing regions of the substrate between the ICs.
Patent
Substrate patterning using hybrid laser scribing and plasma etching processing schemes
TL;DR: In this article, a method of patterning features within a substrate involves forming a mask layer above a surface of a semiconductor or glass substrate, which is then laser ablated to provide a pattern of openings through the mask layer.
Patent
Method for Producing Multiple Layer Systems
TL;DR: In this paper, a method for producing multiple layer systems on a nonconductive substrate was proposed, where metallic layers and electrically non-conductive layers are alternately deposited respectively by means of PVD and PECVD and are modified in such a way that at least one layer can be optionally selectively structured.
Patent
Method for minimizing pink ring in blind laser vias
TL;DR: In this paper, a via is formed on a laminated substrate by forming a copper oxide layer on a copper layer of the substrate by immersing the substrate in copper oxide bath solution for between 30 seconds to 5 minutes.
References
More filters
Patent
Laser beam scanning method for forming via holes in polymer materials
TL;DR: In this article, the surface of a polymer dielectric layer is scanned repeatedly with a high energy continuous wave laser in a pattern to create via holes of desired size, shape and depth.
Journal ArticleDOI
Spectroscopic and fast photographic studies of excimer laser polymer ablation
P. E. Dyer,J. Sidhu +1 more
TL;DR: The time dependence of the expansion for various environmental gas pressures has been studied in this way as discussed by the authors, showing that at low pressures (< 0.5 mb) the expansion approaches a free expansion into a vacuum, while at 15 mb the time dependence is close to that predicted by an ideal blast wave model, suggesting that a significant fraction of the luminous species detected spectroscopically may be created in the shock front at the plume/environmental gas interface.
Patent
Method of laser drilling fluoropolymer materials
TL;DR: In this article, a method of ablating fluoropolymer composition materials is presented wherein it has been found that small holes (less than 100 νm) can be formed in fluoropolymers composition laminate materials using UV lasers to direct laser light through a mask and focusing lens.
Patent
Method for forming vias in multilayer circuits
TL;DR: In this article, a method for rapidly forming a pattern of vias in multilayer electronic circuits in which each of the via holes is formed by drilling with a controlled number of Nd:YAG laser beam pulses is presented.
Journal ArticleDOI
Theory of polymer ablation
TL;DR: In this article, a new formula for the etch depth l per pulse of an excimer laser of fluence F was presented, and it was shown that l is proportional to F, rather than ln(F).
Related Papers (5)
Method of severing electrically conductive links with ultraviolet laser output
Yunlong Sun,Edward J. Swenson +1 more