scispace - formally typeset
Patent

Ultraviolet laser system and method for forming vias in multi-layered targets

Reads0
Chats0
TLDR
In this paper, the output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light for forming vias (72, 74) in multi-layered targets (40).
Abstract
The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for forming vias (72, 74) in multi-layered targets (40). The parameters of the output pulses (62) are selected to facilitate substantially clean, simultaneous or sequential drilling or via formation in a wide variety of materials such as metals, organic dielectrics, and reinforcement materials having different thermal absorption characteristics in response to ultraviolet light. These parameters typically include at least two of the following criteria: high average power of greater than about 100 milliwatts measured over the beam spot area, a temporal pulse width shorter than about 100 nanoseconds, a spot diameter of less than about 50 microns, and a repetition rate of greater than about one kilohertz. The laser system (10) and method circumvent conventional depth of cut saturation limitations and can achieve an increased depth of cut per pulse in a target (40) formed of either single- or multi-layered material.

read more

Citations
More filters
Patent

Metallic interlocking structure

TL;DR: In this article, the authors proposed a method for forming an electronic structure including a metallic interlocking structure for bonding a conductive plated layer to metal surface, and a method of forming the electronic structure.
Patent

Laser printing method and apparatus

TL;DR: In this paper, a laser printing apparatus is formed by a laser oscillator 10, galvano mirrors 42, 44 for scanning the laser light emitted from the laser oscillators, and an fθ lens 40 for focusing it on MCCs 32, 34 serving as the member to be printed.
Patent

Method for increasing throughput of solder mask removal by minimizing the number of cleaning pulses

TL;DR: In this paper, an oscillator module in cooperation with an amplification module is used to generate the laser output, which can be used to clean a bottom surface of a via or the surface of an solder pad to increase process throughput.
Patent

Laser printing method and apparatus for printing characters

TL;DR: In this paper, a laser printing apparatus is formed by a laser oscillator 10, galvano mirrors 42, 44 for scanning the laser light emitted from the laser oscillators, and an fθ lens 40 for focusing the laser lights emitted from a laser on MCCs 32, 34 serving as the member to be printed.
References
More filters
Patent

Laser beam scanning method for forming via holes in polymer materials

TL;DR: In this article, the surface of a polymer dielectric layer is scanned repeatedly with a high energy continuous wave laser in a pattern to create via holes of desired size, shape and depth.
Journal ArticleDOI

Spectroscopic and fast photographic studies of excimer laser polymer ablation

P. E. Dyer, +1 more
TL;DR: The time dependence of the expansion for various environmental gas pressures has been studied in this way as discussed by the authors, showing that at low pressures (< 0.5 mb) the expansion approaches a free expansion into a vacuum, while at 15 mb the time dependence is close to that predicted by an ideal blast wave model, suggesting that a significant fraction of the luminous species detected spectroscopically may be created in the shock front at the plume/environmental gas interface.
Patent

Method of laser drilling fluoropolymer materials

TL;DR: In this article, a method of ablating fluoropolymer composition materials is presented wherein it has been found that small holes (less than 100 νm) can be formed in fluoropolymers composition laminate materials using UV lasers to direct laser light through a mask and focusing lens.
Patent

Method for forming vias in multilayer circuits

TL;DR: In this article, a method for rapidly forming a pattern of vias in multilayer electronic circuits in which each of the via holes is formed by drilling with a controlled number of Nd:YAG laser beam pulses is presented.
Journal ArticleDOI

Theory of polymer ablation

TL;DR: In this article, a new formula for the etch depth l per pulse of an excimer laser of fluence F was presented, and it was shown that l is proportional to F, rather than ln(F).