Water cooled DBC direct bonded copper substrates

TLDR: In this paper, the 3D MCI cooler is used to measure heat dissipation and flow rates of a 3D DBC substrate, which is an ideal solution for very high power applications.

Abstract: Between two insulating DBC substrates (Al/sub 2/O/sub 3/ or AlN) there are structured copper foils bonded together by DBC technology, to build a three dimensional system of micro channels The large internal surface of the highly conductive copper allows an extremely efficient cooling of the DBC substrates The DBC layout is customer specified and both DBCs are mounted to the top and the bottom of the water cooler This compact cooling system designed to the customer's requirements gives four times the system offered efficient cooling of conventional module assemblies with liquid cooling Due to the low weight and the relatively small dimensions the water cooled DBC substrate is an ideal solution for very high power applications In detail we describe the following items: (i) the 3D MCI cooler; (ii) water for cooling; measurement of heat dissipation and flow rates; (iii) results of water flow measurement; and (iv) results of thermal dissipation measurement