Showing papers on "Substrate (printing) published in 2004"

Solution Casting and Transfer Printing Single-Walled Carbon Nanotube Films

Abstract: This paper presents methods for solution casting and transfer printing collections of individual single-walled carbon nanotubes (SWNTs) onto a wide range of substrates, including plastic sheets. The deposition involves introduction of a solvent that removes surfactant from a suspension of SWNTs as it is applied to a substrate. The subsequent controlled flocculation (cF) produces films of SWNTs with densities that can be varied between a few tubes per square micron to thick multilayers in a single deposition step and with orientation determined by the direction of solution flow. High-resolution rubber stamps inked in this manner can be used to print patterns of tubes with geometries defined by the relief structure on the surface of the stamp. Thin film transistors fabricated with these techniques demonstrate their potential use in flexible “macroelectronic” systems.

Liquid crystal display apparatus

Abstract: The display area that displays image of the invention provides rectangular layout of multiple pixels. Those multiple pixels comprise the first pixel, the first spacer for holding liquid crystal layer between the array substrate and the column substrate, the second pixel and the second spacer that is smaller than the first spacer. A column partition is formed as the spacer between the array substrate and the opposed substrate, which is allocated in the second pixel instead of the first pixel, so as to generate the second spacer.

Inkjet printing of well-defined polymer dots and arrays.

Abstract: Inkjet printing represents a highly promising polymer deposition method, which is used for, for example, the fabrication of multicolor polyLED displays and polymer-based electronics parts. The challenge is to print well-defined polymer structures from dilute solution. We have eliminated the formation of ring stains by printing nonvolatile acetophenone-based inks on a perfluorinated substrate using different polymers. (De)pinning of the contact line of the printed droplet, as related to the choice of solvent, is identified as the key factor that determines the shape of the deposit, whereas the choice of polymer is of minor importance. Adding 10 wt % or more of acetophenone to a volatile solvent (ethyl acetate)-based polymer solution changes the shape of the deposit from ring-like to dot-like, which may be due to the establishment of a solvent composition gradient. Arrays of closely spaced dots have also been printed. The size of the dots is considerably smaller than the nozzle diameter. This may prove a potential strategy for the inkjet printing of submicrometer structures.

Functionalized silicon compounds and methods for their synthesis and use

Abstract: Provided are functionalized silicon compounds and methods for their synthesis and use. The functionalized silicon compounds include at least one activated silicon group and at least one derivatizable functional group. Exemplary derivatizable functional groups include hydroxyl, amino, carboxyl and thiol, as well as modified forms thereof, such as activated or protected forms. The functionalized silicon compounds may be covalently attached to surfaces to form functionalized surfaces which may be used in a wide range of different applications. In one embodiment, the silicon compounds are attached to the surface of a substrate comprising silica, such as a glass substrate, to provide a functionalized surface on the substrate, to which molecules, including polypeptides and nucleic acids, may be attached. In one embodiment, after covalent attachment of a functionalized silicon compound to the surface of a solid silica substrate to form a functionalized coating on the substrate, an array of nucleic acids may be covalently attached to the substrate. Thus, the method permits the formation of high density arrays of nucleic acids immobilized on a substrate, which may be used, for example, in conducting high volume nucleic acid hybridization assays.

Electro-optic mirror cell

Abstract: A reflective element assembly (610’) for a variable vehicular mirror includes a front substrate (612) having a transparent conductive coating (618) disposed on a second surface, and a rear substrate (614’) having a third surface conductive coating (620) disposed on its third surface and preferably, a fourth surface conductive coating (635) disposed on its fourth surface. At least a portion of the third surface conductive coating (620) may wrap around an edge portion of the rear substrate (614’) and at least a portion of the fourth surface conductive coating (634, 635) may wrap around (634a, 635a) at least a second portion of the perimeter edge so as to establish electrical continuity between the fourth surface conductive coating (634, 635) on the fourth surface and the third surface conductive coating (620) on the third surface. The rear substrate (614’) may have a smaller dimension than the front substrate (612) so as to provide an overhang region (632a), preferably at the wraparound region.

Processing system and method for treating a substrate

Abstract: A processing system and method for chemical oxide removal (COR), wherein the processing system comprises a first treatment chamber and a second treatment chamber, wherein the first and second treatment chambers are coupled to one another. The first treatment chamber comprises a chemical treatment chamber that provides a temperature controlled chamber, and an independently temperature controlled substrate holder for supporting a substrate for chemical treatment. The substrate is exposed to a gaseous chemistry, such as HF/NH3, under controlled conditions including surface temperature and gas pressure. The second treatment chamber comprises a heat treatment chamber that provides a temperature controlled chamber, thermally insulated from the chemical treatment chamber. The heat treatment chamber provides a substrate holder for controlling the temperature of the substrate to thermally process the chemically treated surfaces on the substrate.

Organic electroluminescent element

Abstract: PROBLEM TO BE SOLVED: To provide an organic EL element in which the organic EL layer is not affected by the sealing material or the like and bubbles generated by the internal pressure at the time of sealing can be reduced, and a manufacturing method of the organic EL element SOLUTION: This is the organic electroluminescent element which comprises a substrate, a first electrode layer formed on the substrate, an organic electroluminescent layer which is formed on the first electrode layer and has at least a luminous layer, a second electrode layer which is formed on the organic electroluminescent layer so as to interpose the organic electroluminescent layer, a sealing base material which is formed opposed to the substrate and has an adhesion part for sealing the substrate, and a seal material which is formed at the outer periphery of the adhesion part of the sealing base material and seals the substrate and the sealing base material A protection layer is provided along the inner circumference of the seal material and formed at the inner circumference of the adhesion part COPYRIGHT: (C)2005,JPO&NCIPI

Techniques for the use of amorphous carbon (APF) for various etch and litho integration scheme

Abstract: A method of etching a substrate is provided. The method of etching a substrate includes transferring a pattern into the substrate using a double patterned amorphous carbon layer on the substrate as a hardmask. Optionally, a non-carbon based layer is deposited on the amorphous carbon layer as a capping layer before the pattern is transferred into the substrate.

Substrate-guided optical devices

Abstract: There is provided an optical device, having a light-transmitting substrate (20) having at least two major surfaces parallel to each other and edges; a display light source; optical means for coupling light from the light source into the substrate (20) by internal reflection, and at least one partially reflecting surface (22) located in the substrate (20) which is non-parallel to the major surfaces of the substrate wherein the source emits light waves located in a given field-of-view, that the light waves are collimated, that an angular resolution is defined for the optical device, and wherein the angular deviation between any two different rays located in one of the collimated light waves, is smaller than the angular resolution.

Process for titanium nitride removal

Abstract: A process of removing titanium nitride from a surface of a substrate includes: providing a process gas including at least one reactant selected from the group consisting of a fluorine-containing substance and a chlorine-containing substance; enriching the process gas with at least one reactive species of the at least one reactant to form an enriched process gas, wherein the enriching is conducted at a first location; providing the substrate at a substrate temperature greater than 50° C., wherein the surface of the substrate is at least partially coated with the titanium nitride; and contacting the titanium nitride on the surface of the substrate with the enriched process gas to volatilize and remove the titanium nitride from the surface of the substrate, wherein the contacting occurs at a second location differing from the first location.

Microcontact Printing of Uniform Nanoparticle Arrays

Abstract: Uniform, close-packed monolayer and bilayer arrays of alkanethiol-coated gold nanoparticles have been used as “ink” for microcontact printing (μCP) following the technique of Xia and Whitesides (see Xia, Y.; Whitesides, G. M. Polym. Mater. Sci. Eng. 1997, 77, 596). The process is accomplished in two steps. First, a uniform monolayer of the nanoparticles is self-assembled on a water surface and is transferred intact to a patterned poly(dimethylsiloxane) (PDMS) stamp pad by the Langmuir−Schaefer (LS) method. In the case of multilayer printing, this “inking” step is repeated as many times as desired. Because multilayer arrays are assembled on the stamp pad layer-by-layer, adjacent layers may be made up of the same or different particles. The nanoparticles are transferred to a solid substrate by conformal contact of the stamp pad and the substrate. The technique has been used to print patterned monolayer and bilayer arrays on both hydrophobic and hydrophilic substrates. The quality of the transferred arrays h...

Flexible OLED displays using plastic substrates

Abstract: Organic light-emitting diodes (OLEDs) displays using plastic substrate have many attractive features. They are ultrathin and light, in addition, it will be realized the flexible display to utilize the flexibility of the substrate. The key issue in achieving such displays is how to protect OLEDs from moisture and oxygen. We developed a barrier film on a plastic substrate and a passivation film on the OLED device itself. As a result, the device showed good emission characteristics after storage, and its characteristics were almost the same as those of a device fabricated on a glass substrate. We also developed a 3-in full-color flexible OLED display.

Intermediate chip module, semiconductor device, circuit board, and electronic device

Abstract: An intermediate chip for electrically connecting semiconductor chips includes: a substrate having a first side and a second side; a trans-substrate conductive plug which projects to the first side of the substrate; a post electrode which is displaced from the trans-substrate conductive plug in plan view on the second side of the substrate; and wiring which is disposed in or on the substrate for coupling the trans-substrate conductive plug and the post electrode.

Exposure apparatus and method for producing device

Abstract: There is provided an exposure apparatus capable of forming a desirable device pattern by removing unnecessary liquid when performing exposure by projecting a pattern onto the substrate via a projection optical system and the liquid. The exposure device projects an image of the pattern onto the substrate P via the projection optical system and the liquid so as to expose the substrate P. The exposure device includes a liquid removing mechanism 40 which removes the liquid remaining on a part 7 arranged in the vicinity of the image plane of the projection optical system.

Semiconductor device and its manufacturing method

Abstract: PROBLEM TO BE SOLVED: To perform wire connection at parts between a plurality of chips by using wires whose width is almost 10μm, without performing metal sputtering and etching, in a semiconductor device which is constituted by mounting a plurality of chips on one main substrate SOLUTION: This semiconductor device is provided with: a chip adapter 10 in which a plurality of trenches are formed and has insulation; a plurality of semiconductor substrates 11-13 on which I/O pads P and prescribed circuits are formed and which are inserted in the plurality of trenches of the chip adapter 10, respectively; and the wiring 20 which is formed on the plurality of semiconductor substrates and the chip adapter and electrically connects the I/O pads with each other in parts between the plurality of semiconductor substrates COPYRIGHT: (C)2004,JPO

Vertical memory device structures

Abstract: Vertically oriented semiconductor memory cells are added to a separately fabricated substrate that includes electrical devices and/or interconnect. The plurality of vertically oriented semiconductor memory cells are physically separated from each other, and are not disposed within the same semiconductor body. The plurality of vertically oriented semiconductor memory cells can be added to the separately fabricated substrate as a thin layer including several doped semiconductor regions which, subsequent to attachment, are etched to produce individual doped stack structures, which are then supplied with various dielectric coatings, gate electrodes, and contacts by means of further processing operations. Alternatively, the plurality of vertically oriented semiconductor memory cells may be completely fabricated prior to attachment. DRAMs, SRAMs, non-volatile memories, and combinations of memory types can be provided.

Process and integration scheme for fabricating conductive components through-vias and semiconductor components including conductive through-wafer vias

Abstract: A method for forming a conductive via in a semiconductor component is disclosed. The method includes providing a substrate (112) having a first surface and an opposing, second surface. At least one hole (118) is formed in the substrate extending between the first surface and the opposing, second surface. A seed layer (128) is formed on a sidewall defining the at least one hole of the substrate and coated with a conductive layer (130), and a conductive or nonconductive filler material (136) is introduced into the remaining space within the at least one hole. A method of forming a conductive via through a substrate using a blind hole is also disclosed. Semiconductor components and electronic systems having substrates including the conductive via of the present invention are also disclosed.

Adhesive backed displays

Abstract: A process for creating an electronically addressable display includes multiple printing operations, similar to a multi-color process in conventional screen printing. In some of the process steps, electrically non-active inks are printed onto areas of the receiving substrate, and in other steps, electrically active inks are printed onto different areas of the substrate. The printed display can be used in a variety of applications. This display can be used as an indicator by changing state of the display after a certain time has elapsed, or when a certain pressure, thermal, radiative, moisture, acoustic, inclination, pH, or other threshold is passed. In one embodiment, the display is incorporated into a battery indicator. A sticker display is described. The sticker is adhesive backed and may then be applied to a surface to create a functional information display unit. This invention also features a display that is both powered and controlled using radio frequencies. It describes a complete system for controlling, addressing, and powering a display. The system includes an antenna or antennae, passive charging circuitry, and active control system, a display, and an energy storage unit. There is also a separate transmitter that provides the remote power for the display. The system is meant to be used anywhere it is useful to provide intermittent updates of information such as in a store, on a highway, or in an airport. A tile-based display allowing a modular system for large area display is created using a printable display material.

Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them

Abstract: In accordance with the invention, an illumination device comprises a substrate having a surface and a cavity in the surface. At least one light emitting diode (“LED”) is mounted within the cavity, and a monolayer comprising phosphor particles overlies the LED. The phosphor monolayer is adhered to the LED by a monolayer of transparent adhesive material. An optional optical thick layer of transparent material overlies the phosphor monolayer to encapsulate the LED and optionally to form a lens. Methods and apparatus for efficiently making the devices are disclosed.

Microfluidic device with thin-film electronic devices

Abstract: A microfluidic device (90) for analysis of a sample The microfluidic device includes a substrate portion (94) that at least partially defines a chamber (102) for receiving the sample The substrate portion (94) includes a substrate (98) having a surface (96) The substrate portion (94) also includes a plurality of thin-film layers (110) formed on the substrate (98) adjacent the surface (96) The thin-film layers (110) form a plurality of electronic devices Each of at least two of the electronic devices is formed by a different set of the thin-film layers (110) The at least two electronic devices may include 1) a temperature control device for controlling the temperature of fluid in the chamber (102), and 2) an other electronic device configured to sense or modify a property of fluid in the chamber (102)

Yttria-coated ceramic components of semiconductor material processing apparatuses and methods of manufacturing the components

Abstract: Yttria-coated ceramic components of semiconductor material processing apparatuses include a substrate and at least one yttria-containing coating on the substrate. The components are made by applying a first yttria-containing coating on a ceramic substrate, which can be a green body of the ceramic material. The coated green body is sintered. The first yttria-containing coating can be treated to remove attached yttria particles resulting from the sintering. In another embodiment, a second yttria-containing coating can be thermally sprayed on the first yttria-containing coating to cover the particles.

Cleanable high efficiency filter media structure and applications for use

Abstract: An improved cartridge, typically in cylindrical or panel form that can be used in a dry or wet/dry vacuum cleaner. The cartridge is cleanable using a stream of service water, or by rapping on a solid object, or by using a compressed gas stream, but can provide exceptional filtering properties even for submicron particulate in the household or industrial environment. The cartridge has a combination of nanofiber filtration layer on a substrate. The nanofiber and substrate are engineered to obtain a maximum efficiency at reasonable pressure drop and permeability. The improved cartridge constitutes at least a substrate material and at least a layer including a non-woven, fine fiber separation layer.

Patterned conductor touch screen having improved optics

Abstract: The present invention provides a touch screen that includes a pattern of transparent conductors as touch sensing elements, and that has a layered construction configured to reduce the visibility of the transparent conductor pattern. The construction includes a coating covering a substrate, the transparent conductor pattern disposed on the coating, and a filler material covering and contacting the transparent conductor pattern and the areas of the coating not covered by the transparent conductor pattern, where the index of refraction of the filler material is less than the index of refraction of the substrate and less than the index of refraction of the transparent conductor pattern.

Vacuum processing apparatus

Abstract: PROBLEM TO BE SOLVED: To simplify substrate transfer processes of a vacuum processing apparatus. SOLUTION: The vacuum processing apparatus 10 has a loading/unloading chamber 11, a preliminarily heating chamber 12, and a processing chamber 13. In the preliminarily heating chamber 12, there are provided a forward transfer apparatus 22, a backward transfer apparatus 32, and a heater H for heating a substrate W. The one heater H is provided on the side of the forward transfer apparatus 22. Forward transfer apparatuses 21, 22 transfer forward the substrate W, and backward transfer apparatuses 31, 32 transfer backward the processed-off substrate W. The loading/unloading chamber 11 is a chamber capable of switching atmospheric releasing to vacuous sealing, and vice versa, and the substrate W is so inputted from the loading/unloading chamber 11 as to be recovered by the chamber 11 via transfer operations x2-x5. COPYRIGHT: (C)2006,JPO&NCIPI

Method of fabricating vertical structure compound semiconductor devices

Abstract: A method of fabricating a vertical structure opto-electronic device includes fabricating a plurality of vertical structure opto-electronic devices on a crystal substrate, and then removing the substrate using a laser lift-off process. The method then fabricates a metal support structure in place of the substrate. In one aspect, the step of fabricating a metal support structure in place of the substrate includes the step of plating the metal support structure using at least one of electroplating and electro-less plating. In one aspect, the vertical structure is a GaN-based vertical structure, the crystal substrate includes sapphire and the metal support structure includes copper. Advantages of the invention include fabricating vertical structure LEDs suitable for mass production with high reliability and high yield.

Planographic printing plate precursor

Abstract: A planographic printing plate precursor, including: a substrate; a photosensitive layer containing an IR absorber, a polymerization initiator, a polymerizable compound and a binder polymer; and a protective layer containing a UV absorber, disposed in this order. The photosensitive layer exhibits reduction in solubility in an alkaline developing solution upon being exposed to light having a wavelength of 750 nm to 1400 nm.

Exposure device and device manufacturing method

Abstract: There is provided an exposure apparatus capable of forming a desirable device pattern by removing unnecessary liquid when performing exposure by projecting a pattern onto the substrate via a projection optical system and the liquid. The exposure device projects an image of the pattern onto the substrate P via the projection optical system and the liquid so as to expose the substrate P. The exposure device includes a liquid removing mechanism 40 which removes the liquid remaining on a part 7 arranged in the vicinity of the image plane of the projection optical system.

System and process for producing nanowire composites and electronic substrates therefrom

Abstract: The present invention relates to a system and process for producing a nanowire-material composite. A substrate (602) having nanowires (606) attached to a portion (604) of at least one surface is provided. A material is deposited over the portion to form the nanowire-material composite. The process further optionally comprises separating the nanowire-material composite from the substrate to form a freestanding nanowire-material composite. The freestanding nanowire material composite is optionally further processed into a electronic substrate. A variety of electronic substrates can be produced using the methods described herein. For example, a multi-color light-emitting diode can be produced from multiple, stacked layers of nanowire-material composites, each composite layer emitting light at a different wavelength.

Organic electroluminescent display device and method of fabricating the same

Abstract: An organic electroluminescent display device includes a first substrate, a second substrate spaced apart from and facing the first substrate to form a space therebetween, an array element on an inner surface of the first substrate, an organic electroluminescent diode on an inner surface of the second substrate, a seal pattern along a peripheral portion between the first and second substrates, and a connection pattern electrically interconnecting the array element and the organic electroluminescent diode, wherein a pressure within the space between the first and second substrates is lower than an ambient atmospheric pressure.

Process for producing metal thin films by ALD

Abstract: The invention relates generally to processes for producing electrically conductive noble metal thin films on a substrate by atomic layer deposition. According to one embodiment of the invention a substrate with a surface is provided in a reaction chamber and a vaporised precursor of a noble metal is pulsed into the reaction chamber. By contacting the vaporised precursor with the surface of the substrate, no more than about a molecular layer of the metal precursor is formed on the substrate. In a next step, a pulse of molecular oxygen-containing gas is provided in the reaction chamber, where the oxygen reacts with the precursor on the substrate. Thus, high-quality metal thin films can be deposited by utilising reactions between the metal precursor and oxygen. In one embodiment, electrically conductive layers are deposited in structures that have high aspect ratio vias and trenches, local high elevation areas or other similar surface structures that make the surface rough.