Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.

A Survey of Wide Bandgap Power Semiconductor Devices

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Art of electronics

Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

The fact that wide bandgap semiconductors are capable of electronic functionality at much higher temperatures than silicon has partially fueled their development, particularly in the case of SiC. It appears unlikely that wide bandgap semiconductor devices will find much use in low-power transistor applications until the ambient temperature exceeds approximately 300/spl deg/C, as commercially available silicon and silicon-on-insulator technologies are already satisfying requirements for digital and analog VLSI in this temperature range. However practical operation of silicon power devices at ambient temperatures above 200/spl deg/C appears problematic, as self-heating at higher power levels results in high internal junction temperatures and leakages. Thus, most electronic subsystems that simultaneously require high-temperature and high-power operation will necessarily be realized using wide bandgap devices, once they become widely available. Technological challenges impeding the realization of beneficial wide bandgap high ambient temperature electronics, including material growth, contacts, and packaging, are briefly discussed.

High-temperature electronics - a role for wide bandgap semiconductors?

Power semiconductor devices are key components in power conversion systems. Silicon carbide (SiC) has received increasing attention as a wide-bandgap semiconductor suitable for high-voltage and low-loss power devices. Through recent progress in the crystal growth and process technology of SiC, the production of medium-voltage (600?1700 V) SiC Schottky barrier diodes (SBDs) and power metal?oxide?semiconductor field-effect transistors (MOSFETs) has started. However, basic understanding of the material properties, defect electronics, and the reliability of SiC devices is still poor. In this review paper, the features and present status of SiC power devices are briefly described. Then, several important aspects of the material science and device physics of SiC, such as impurity doping, extended and point defects, and the impact of such defects on device performance and reliability, are reviewed. Fundamental issues regarding SiC SBDs and power MOSFETs are also discussed.

https://iopscience.iop.org/article/10.7567/JJAP.54.040103/pdf

Material science and device physics in SiC technology for high-voltage power devices

In this study, tungsten carbide, with its hardness, chemical inertness, thermal stability and low resistivity (25 mu Omega cm)(1) is shown as a reliable contact material to n- and p-type 6H-SiC for ...

CVD-based tungsten carbide Schottky contacts to 6H-SiC for very high-temperature operation

This paper presents a monolithic fully differential amplifier implemented in a low-voltage 4H-silicon carbide bipolar junction transistor technology. The circuit has been designed, considering the variation of device parameters over a large temperature range. A base-current compensation technique has been applied to overcome the low input resistance of the amplifier. The bare chip of the amplifier has been measured from 27 °C to 500 °C using a hot-chuck probe station. Its open-loop gain is 58 dB at 27 °C, and monotonically decreases to 37 dB at 500 °C. Its closed-loop gain reduction is $\sim 5$ dB over the investigated temperature range. The gain-bandwidth product drops from 2.8 MHz at 27 °C to 1.3 MHz at 500 °C with 470 pF off-chip compensation capacitors. A low total-harmonic-distortion of −58.4 dB at 27 °C and −46.9 dB at 500 °C is achieved due to the fully differential implementation. A low input offset voltage of 0.5 mV at 27 °C and 6.9 mV at 500 °C is achieved without calibration. The relative high linearity and the low offset demonstrate the potential of this technology to be further investigated for the front-end sensor circuits in high-temperature applications.

/pdf/silicon-carbide-fully-differential-amplifier-characterized-er9gk0xr5l.pdf

Silicon Carbide Fully Differential Amplifier Characterized Up to 500 °C

Silicon Carbide (SiC) is an excellent candidate for high temperature electronics applications, thanks to its wide bandgap. SiC power BJTs are commercially available nowadays, and it is demanding to drive them efficiently. This paper reports on the design, layout specifics, and measurements results of a SiC drive integrated circuit (IC) designed for driving SiC power BJTs. The circuit has been tested in different loading conditions (resistive and capacitive), at switching frequencies up to 500kHz, and together with a commercial power BJT. The SiC drive IC is shown to have a robust operation over the entire temperature range from 25 °C to 500 °C.

A monolithic SiC drive circuit for SiC Power BJTs

GaN/SiC heterojunctions can improve the performance considerably for bipolar transistors based on SiC technology. In order to fabricate such devices with a high current gain, the origin of the low turn-on voltage for the heterojunction has to be investigated, which is believed to decrease the minority carrier injection considerably. In this work heterojunction diodes are compared and characterized. For the investigated diodes, the GaN layers have been grown by molecular beam epitaxy (MBE), metal organic chemical vapor deposition, and hydride vapor phase epitaxy. A diode structure fabricated with MBE is presented here, whereas others are collected from previous publications. The layers were grown either with a low temperature buffer, AlN buffer, or without buffer layer. The extracted band offsets are compared and included in a model for a recombination process assisted by tunneling, which is proposed as explanation for the low turn-on voltage. This model was implemented in a device simulator and compared to the measured structures, with good agreement for the diodes with a GaN layer grown without buffer layer. In addition the band offset has been calculated from Schottky barrier measurements, resulting in a type II band alignment with a conduction band offset in the range 0.6–0.9 eV. This range agrees well with the values extracted from capacitance–voltage measurements.

The influence of band offsets on the IV characteristics for GaN/SiC heterojunctions

The p-i-n ultraviolet (UV) photodiodes based on 4H-SiC have been fabricated and characterized from room temperature (RT) to 550 °C. Due to bandgap narrowing at higher temperatures, the photocurrent of the photodiode increases by 9 times at 365 nm and reduces by 2.6 times at 275 nm from RT to 550 °C. Moreover, a 4H-SiC p-i-n photodiode array has been fabricated. Each column and row of the array is separately connected by two-layer metallization.

Carl-Mikael Zetterling

Papers

CVD-based tungsten carbide Schottky contacts to 6H-SiC for very high-temperature operation

Silicon Carbide Fully Differential Amplifier Characterized Up to 500 °C

A monolithic SiC drive circuit for SiC Power BJTs

The influence of band offsets on the IV characteristics for GaN/SiC heterojunctions

550 °C 4H-SiC p-i-n Photodiode Array With Two-Layer Metallization