C
Chao-Kun Hu
Researcher at IBM
Publications - 71
Citations - 4250
Chao-Kun Hu is an academic researcher from IBM. The author has contributed to research in topics: Electromigration & Copper interconnect. The author has an hindex of 26, co-authored 71 publications receiving 4058 citations. Previous affiliations of Chao-Kun Hu include Samsung.
Papers
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Journal ArticleDOI
Copper Metallization for High Performance Silicon Technology
TL;DR: In this article, the authors describe the development of an electroplating process for the copper network, dual-damascence chem-mech polishing (CMP), and effective liner material for copper diffusion barrier and adhesion promotion.
Journal ArticleDOI
Mechanisms for microstructure evolution in electroplated copper thin films near room temperature
James Mckell Edwin Harper,C. Cabral,Panayotis C. Andricacos,Lynne Gignac,Ismail C. Noyan,Kenneth P. Rodbell,Chao-Kun Hu +6 more
TL;DR: In this paper, a model based on grain boundary energy in the fine-grained as-deposited films providing the underlying energy density which drives abnormal grain growth is presented.
Journal ArticleDOI
Electromigration path in Cu thin-film lines
TL;DR: For wide polycrystalline lines, the dominant diffusion mechanism is a mixture of grain boundary and surface diffusion, while in narrow lines (< 1 μm) the dominant mechanism is surface transport as mentioned in this paper.
Patent
Reduced electromigration and stressed induced migration of Cu wires by surface coating
TL;DR: In this paper, the free surface of patterned Cu conducting lines in on-chip interconnections (BEOL) wiring is covered by a 1-20 nm thick metal layer prior to deposition of the interlevel dielectric.
Journal ArticleDOI
Reduced electromigration of Cu wires by surface coating
Chao-Kun Hu,Lynne Gignac,Robert Rosenberg,Eric G. Liniger,Judith M. Rubino,Carlos J. Sambucetti,A. Domenicucci,Xiaomeng Chen,Anthony K. Stamper +8 more
TL;DR: In this article, a 10-20 nm thick metal cap was proposed to improve the lifetime of on-chip Cu damascene lines by providing protection against interface diffusion of Cu which has been the leading contributor to metal line failure.