Francesco de Paulis

TL;DR: In this article, a cascaded S-parameter method is proposed for signal/power integrity analysis of multiple vias in a multilayer printed circuit board (PCB), which enables efficient and accurate construction and simulation of physics-based via model for complex multi-layer PCB structures involving vias.

TL;DR: In this article, the authors investigated the power integrity behavior of planar EBG structures embedded between two solid layers within the stack-up of a multilayer printed circuit board and found that the bandgap generation and power integrity performance of the embedded EBG can be achieved only by placing vias shorting the solid planes above and below the patterned layer.

TL;DR: In this article, the authors proposed a noninvasive defect analysis method for high-speed TSV channel with designed and fabricated test vehicles, and the proposed method is demonstrated with time-domain reflectometry measurement results.

TL;DR: In this paper, the authors describe a systematic study on the near-field behavior of an electromagnetic interference (EMI) noise suppression absorber materials considering two different types of commercial absorbers and different kinds of excitation source: at first, elementary electric dipole and elementary magnetic loop, and then using real dimensions of a coaxial cable for designing a dipole.

TL;DR: In this paper, an equivalent circuit model for the transient analysis of through-silicon vias (TSV) taking into account nonlinear metaloxide-semiconductor effects is proposed.