Y
Yaojiang Zhang
Researcher at Huawei
Publications - 80
Citations - 1727
Yaojiang Zhang is an academic researcher from Huawei. The author has contributed to research in topics: Printed circuit board & Power integrity. The author has an hindex of 21, co-authored 80 publications receiving 1492 citations. Previous affiliations of Yaojiang Zhang include Institute of High Performance Computing Singapore & Agency for Science, Technology and Research.
Papers
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Journal ArticleDOI
Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects
Er-Ping Li,Xing-Chang Wei,Andreas C. Cangellaris,En-Xiao Liu,Yaojiang Zhang,Marcello D'Amore,Joungho Kim,Toshio Sudo +7 more
TL;DR: In this article, the state of the arts of IC, electronic package, and printed circuit board simulation and modeling technologies are summarized for both available structures [multilayered powerground planes and macromodeling of interconnect (INC)] and novel structures (nano-INCs and 3-D ICs based on through-silicon via technology).
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Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz
Renato Rimolo-Donadio,Xiaoxiong Gu,Young H. Kwark,Mark B. Ritter,Bruce Archambeault,F. de Paulis,Yaojiang Zhang,Jun Fan,Heinz-Dietrich Bruns,Christian Schuster +9 more
TL;DR: In this paper, an analytical model for vias and traces is presented for simulation of multilayer interconnects at the package and printed circuit board levels, which can be applied to efficiently simulate a wide range of structures.
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Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages
TL;DR: In this article, the via-plate capacitance for a via transition to a multilayer printed circuit board is evaluated analytically in terms of higher order parallel-plate modes.
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A 2.5-D Angularly Stable Frequency Selective Surface Using Via-Based Structure for 5G EMI Shielding
TL;DR: In this article, a broadband bandpass frequency-selective surface (FSS) designed for 5G EMI shielding is proposed, which employs the vertical vias into the 2-D periodic arrays, and such a single 2.5D periodic layer of via-based structure is demonstrated to produce a highly stable angular response up to 60° for both TE and TM polarizations.
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An Intrinsic Circuit Model for Multiple Vias in an Irregular Plate Pair Through Rigorous Electromagnetic Analysis
Yaojiang Zhang,Jun Fan +1 more
TL;DR: In this paper, an irregular plate pair with multiple vias is analyzed by the segmentation method that divides the plate pair into a plate domain and via domains, all the parallel-plate modes are considered, while in the plate domain, only the propagating modes are included to account for the coupling among vias and the reflection from plate edges.