H
Hermann Oppermann
Researcher at Fraunhofer Society
Publications - 105
Citations - 1614
Hermann Oppermann is an academic researcher from Fraunhofer Society. The author has contributed to research in topics: Flip chip & Wafer. The author has an hindex of 19, co-authored 103 publications receiving 1497 citations. Previous affiliations of Hermann Oppermann include Technical University of Berlin.
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Journal ArticleDOI
Integrated wireless neural interface based on the Utah electrode array.
Sohee Kim,Rajmohan Bhandari,M. Klein,Sandeep Negi,Loren Rieth,Prashant Tathireddy,Michael Toepper,Hermann Oppermann,Florian Solzbacher +8 more
TL;DR: The materials and processes used to generate the integrated neural interface device were found to yield a robust and reliable integrated package.
Journal ArticleDOI
Interlayer cooling potential in vertically integrated packages
Thomas Brunschwiler,Bruno Michel,Hugo E. Rothuizen,Urs Kloter,Bernhard Wunderle,Hermann Oppermann,Herbert Reichl +6 more
TL;DR: In this paper, the heat-removal capability of area-interconnect-compatible interlayer cooling in vertically integrated, high-performance chip stacks was characterized with de-ionized water as coolant.
Journal ArticleDOI
Prototype ATLAS IBL modules using the FE-I4A front-end readout chip
J. Albert,Xiao-Chao Fang,D.S. Smith,Clara Nellist,Mathieu Benoit,Andre Rummler,Craig Buttar,Marzio Nessi,Fabian Hügging,Gabriel Pelleriti,Abraham Seiden,Alessandro Rovani,Raphael Vuillermet,Marina Cobal,P. Skubic,Hans Peter Beck,David Pohl,Konstantin Toms,P. Breugnon,Ming-Lee Chu,David Salek,B. DeWilde,Stephen Gibson,R. D. Kass,John Stupak,David Elldge,Giulio Pellegrini,Stephen Watts,Martin Hoeferkamp,Alex Sood,Vaclav Vrba,Renaud Gaglione,Angela Kok,Jean-Francois Arguin,Christian Zeitnitz,Pierre Delebecque,Pierre-Yves David,F. Gensolen,Javier Mesa,Claudia Gemme,Hermann Oppermann,Neal Hartman,Jacques Ballansat,Gianluca Alimonti,Maurizio Boscardin,Markus Elsing,Frank Jensen,Mohsine Menouni,Yannick Favre,Thibaut Gastaldi,I. V. Gorelov,S. Mitsui,Tamer Yildizkaya,Tobias Lapsien,R. Beccherle,Jean Tassan,Sherwood Parker,Ingrid-Maria Gregor,N. Dinu,Marco Ciapetti,Harris Kagan,Kerstin Lantzsch,A. Micelli,Auke-Pieter Colijn,Abderrazak Mekkaoui,Johann Collot,Alessandro Gabrielli,Didier Laporte,Giovanni Darbo,Michele Battistin,Jasmine Hasi,Abdenour Lounis,Antonio Zoccoli,Simone Coelli,Silvia Miglioranzi,P. Kind,Norbert Wermes,G. Barbier,A. Wiese,Markus Nordberg,Martin Hetmánek,Vladimir Cindro,N. Schroer,D. Nelson,MarioPaolo Giordani,Elisa Vianello,G. Marchiori,Ole Røhne,M. Povoli,M. Strang,Wittgen Matthias,Sourabh Dube,Maurice Garcia-Sciveres,O. Crespo-Lopez,Leah Caminada,Matthias George,Francois-Xavier Nuiry,Anna Macchiolo,N. Massol,Gianluigi Casse,Lucian Ancu,Peter Buchholz,T. Fritzsch,Jens Dopke,Marcello Borri,Henry Lubatti,Jennifer Jentzsch,Paolo Morettini,P. K. Teng,Sabine Elles,Jean-Yves Hostachy,Chiara Meroni,Andrea Catinaccio,Tomasz Hemperek,Ludovic Eraud,Danilo Giugni,David Arutinov,Ali Harb,Timon Heim,P. Weigell,Dean Forshaw,S. Michal,Beate Heinemann,Gabriele Giacomini,Edwin Spencer,Jorn Grosse-Knetter,Jan-David Schipper,Didier Ferrere,Stephan von Kleist,Oswin Ehrmann,P. Mättig,Nicola Zorzi,Shota Tsiskaridze,I. Rubinskiy,Ilya Tsurin,Davide Falchieri,Sally Seidel,Marko Mikuž,Hans Krüger,R. Kluit,Laurent Vacavant,Alvise Bagolini,E. Devetak,M. Capeans,G.-F.D. Betta,Denis Diyakov,Fares Djama,V. Zivkovic,N. Bousson,Martin Kocian,Eric Vigeolas,Yunpeng Lu,Erik Richards,Lukasz Zwalinski,Heinz Pernegger,Basil Schneider,Franck Cadoux,Clara Troncon,O. Dorholt,Claus Gössling,J. Idarraga,Heidi Sandaker,Rui Wang,Alessandro Polini,Marc Weber,Sebastian Grinstein,D. Fougeron,Dario Gnani,Matthew Scott Rudolph,Patrick Baudin,Marteen Weber,Andreas Salzburger,G. Calderini,Graziano Bruni,Kirill Egorov,Ettore Ruscino,Igor Mandić,Xavier Portell Bueso,Susumu Terada,Chung-Hang Lai,Petr Sicho,Francesco Ragusa,Andre Kruth,Manuel Neumann,G. Boyd,D. Puldon,Andrey Dushkin,Jan Godlewski,Mauro Monti,Alexandre Rozanov,J. Moore,Yoshinobu Unno,M. Karagounis,Riccardo Travaglini,Jacques Chauveau,Christopher J. Kenney,Michal Ziolkowski,Yosuke Takubo,Thor-Erik Hansen,J. Fleury,Heather Gray,Andrej Gorišek,Steven David Welch,Richard Nisius,Daniel Muenstermann,Alessandro La Rosa,John Joseph,Mario Rothermund,Philippe Grenier,B. Stugu,Yuriy Pylypchenko,Giuseppe Iacobucci,Marco Oriunno,Coralie Husi,Vadim Kostyukhin,David Quirion,Tobias Flick,Jiří Popule,Antonio Ereditato,Andreas Eyring,T. Todorov,Jose Antonio Botelho Direito,C. DaVia,Sergio Grancagnolo,Els Koffeman,Peyton D. Murray,Michal Tomášek,Michal Sloboda,Giuseppe Gariano,Susanne Kersten,Aboud Falou,Tristan Beau,William F. Kuykendall,Bart Verlaat,T. Wittig,Daniel Dobos,Manuel Lozano,Attilio Picazio,Branislav Ristic,P. P. Allport,Ilya Korolkov,Silke Altenheiner,Marco Bomben,C. Gallrapp,C. Padilla,Philippe Schwemling,Camille Fausten,Daly Colin,Thibaut Rambure,U. Mallik,D. Grondin,Mauro Citterio,Dmitri Tsybychev,Richard Bates,Marlon Barbero,Fridolin Dittus,A. L. S. Schorlemmer,Malte Backhaus,Celeste Fleta,Siegfried Wenig,Arnulf Quadt,Andreas Kugel,Jim Bensinger,Kate Doonan,Jens Jansen,Matteo Cavalli-Sforza,Jens Weingarten,P. Hansson,Markus Alex,H. Gjersdal,Allan G Clark,N. Krieger,Beniamino Di Girolamo,Karl Walter Glitza,Franziska Hegner,Nicola Giacinto Piacquadio,Laura Gonella,D. Su,S. Debieux,Reiner Klingenberg,Denis Marchand,Attilio Andreazza,K. K. Gan,Johann Menu,Marco Bruschi,Yoichi Ikegami,Oleksandr Korchak,Nigel Hessey,Luc Jansen,Daniel Dzahini,Patrick Ghislain,William Trischuk,Zdenko Janoška,V. Gromov,Georg Troska +294 more
TL;DR: In this article, the ATLAS Collaboration will upgrade its semiconductor pixel tracking detector with a new Insertable B-layer (IBL) between the existing pixel detector and the vacuum pipe of the Large Hadron Collider.
Proceedings ArticleDOI
Forced convective interlayer cooling in vertically integrated packages
Thomas Brunschwiler,Bruno Michel,Hugo E. Rothuizen,Urs Kloter,Bernhard Wunderle,Hermann Oppermann,Herbert Reichl +6 more
TL;DR: In this article, the heat removal capability of area-interconnect-compatible interlayer cooling in vertically integrated, high-performance chip stacks was characterized with de-ionized water as coolant.
Journal ArticleDOI
Development of an assembly process and reliability investigations for flip-chip LEDs using the AuSn soldering
TL;DR: In this paper, a packaging process for flip-chip LEDs (light emitting diodes) is described, where the LEDs are picked and placed on a silicon substrate wafer.