Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.

A Survey of Wide Bandgap Power Semiconductor Devices

An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

The solid-state transformer (SST), which has been regarded as one of the 10 most emerging technologies by Massachusetts Institute of Technology (MIT) Technology Review in 2010, has gained increasing importance in the future power distribution system. This paper presents a systematical technology review essential for the development and application of SST in the distribution system. The state-of-the-art technologies of four critical areas are reviewed, including high-voltage power devices, high-power and high-frequency transformers, ac/ac converter topologies, and applications of SST in the distribution system. In addition, future research directions are presented. It is concluded that the SST is an emerging technology for the future distribution system.

Review of Solid-State Transformer Technologies and Their Application in Power Distribution Systems

Silicon carbide (SiC) power devices have been investigated extensively in the past two decades, and there are many devices commercially available now. Owing to the intrinsic material advantages of SiC over silicon (Si), SiC power devices can operate at higher voltage, higher switching frequency, and higher temperature. This paper reviews the technology progress of SiC power devices and their emerging applications. The design challenges and future trends are summarized at the end of the paper.

https://ieeexplore.ieee.org/ielaam/41/8031005/7815312-aam.pdf

Review of Silicon Carbide Power Devices and Their Applications

Power semiconductor devices are key components in power conversion systems. Silicon carbide (SiC) has received increasing attention as a wide-bandgap semiconductor suitable for high-voltage and low-loss power devices. Through recent progress in the crystal growth and process technology of SiC, the production of medium-voltage (600?1700 V) SiC Schottky barrier diodes (SBDs) and power metal?oxide?semiconductor field-effect transistors (MOSFETs) has started. However, basic understanding of the material properties, defect electronics, and the reliability of SiC devices is still poor. In this review paper, the features and present status of SiC power devices are briefly described. Then, several important aspects of the material science and device physics of SiC, such as impurity doping, extended and point defects, and the impact of such defects on device performance and reliability, are reviewed. Fundamental issues regarding SiC SBDs and power MOSFETs are also discussed.

https://iopscience.iop.org/article/10.7567/JJAP.54.040103/pdf

Material science and device physics in SiC technology for high-voltage power devices

The phenomenon of recombination-induced stacking faults in high-voltage p-n diodes in SiC has been previously shown to increase the forward voltage drop due to reduction of minority carrier lifetime. In this paper, it has been shown that, for the first time, this effect is equally important in unipolar devices such as high-voltage MOSFETs. If the internal body diode is allowed to be forward biased during the operation of these devices, then the recombination-induced SFs will reduce the majority carrier conduction current and increase the leakage current in blocking mode. The effect is more noticeable in high-voltage devices where the drift layer is thick and is not expected to impact 600-1200-V devices.

A New Degradation Mechanism in High-Voltage SiC Power MOSFETs

Since Cree, Inc.'s 2
 nd
 generation 4H-SiC MOSFETs were commercially released with a specific on-resistance (R
 ON, SP
) of 5 mΩ·cm
 2
 for a 1200 V-rating in early 2013, we have further optimized the device design and fabrication processes as well as greatly expanded the voltage ratings from 900 V up to 15 kV for a much wider range of high-power, high-frequency, and high-voltage energy-conversion and transmission applications. Using these next-generation SiC MOSFETs, we have now achieved new breakthrough performance for voltage ratings from 900 V up to 15 kV with a R
 ON, SP
 as low as 2.3 mΩ·cm
 2
 for a breakdown voltage (BV) of 1230 V and 900 V-rating, 2.7 mΩ·cm
 2
 for a BV of 1620 V and 1200 V-rating, 3.38 mΩ·cm
 2
 for a BV of 1830 V and 1700 V-rating, 10.6 mΩ·cm
 2
 for a BV of 4160 V and 3300 V-rating, 123 mΩ·cm
 2
 for a BV of 12 kV and 10 kV-rating, and 208 mΩ·cm
 2
 for a BV of 15.5 kV and 15 kV-rating. In addition, due to the lack of current tailing during the bipolar device switching turn-off, the SiC MOSFETs reported in this work exhibit incredibly high frequency switching performance over their silicon counter parts.

Silicon carbide power MOSFETs: Breakthrough performance from 900 V up to 15 kV

A compact circuit simulator model is used to describe the performance of a 2-kV, 5-A 4-H silicon carbide (SiC) power DiMOSFET and to perform a detailed comparison with the performance of a widely used 400-V, 5-A Si power MOSFET. The model's channel current expressions are unique in that they include the channel regions at the corners of the square or hexagonal cells that turn on at lower gate voltages and the enhanced linear region transconductance due to diffusion in the nonuniformly doped channel. It is shown that the model accurately describes the static and dynamic performance of both the Si and SiC devices and that the diffusion-enhanced channel conductance is essential to describe the SiC DiMOSFET on-state characteristics. The detailed device comparisons reveal that both the on-state performance and switching performance at 25degC are similar between the 400-V Si and 2-kV SiC MOSFETs, with the exception that the SiC device requires twice the gate drive voltage. The main difference between the devices is that the SiC has a five times higher voltage rating without an increase in the specific on-resistance. At higher temperatures (above 100degC), the Si device has a severe reduction in conduction capability, whereas the SiC on-resistance is only minimally affected

Silicon Carbide Power MOSFET Model and Parameter Extraction Sequence

Microgrids with distributed generation sources are critical for reduction of greenhouse gas emissions and imported energy. However, power converters and circuit breakers built with silicon (Si) switches are too bulky and inefficient to be used in the microgrid system. The development of high-voltage power devices based on silicon carbide (SiC) will be a critical component in building the microgrid with distributed and fluctuating sources of power generation. In this paper, the physics and technology of high-voltage (>10 kV) 4H-SiC power devices, namely MOSFETs and insulated gate bipolar transistors are discussed. A detailed review of the current status and future trends in these devices is given with respect to materials growth, device design, and fabrication processing.

SiC Power Devices for Microgrids

The first high voltage npn bipolar junction transistors (BJTs) in 4H-SiC have been demonstrated. The BJTs were able to block 1800 V in common emitter mode and showed a peak current gain of 20 and an on-resistance of 10.8 m/spl Omega//spl middot/cm/sup 2/ at room temperature (I/sub C/=2.7 A @ V/sub CE/=2 V for a 1 mm/spl times/1.4 mm active area), which outperforms all SiC power switching devices reported to date. Temperature-stable current gain was observed for these devices. This is due to the higher percent ionization of the deep level acceptor atoms in the base region at elevated temperatures, which offsets the effects of increased minority carrier lifetime at high temperatures. These transistors show a positive temperature coefficient in the on-resistance characteristics, which will enable easy paralleling of the devices.

Sei-Hyung Ryu

Papers

A New Degradation Mechanism in High-Voltage SiC Power MOSFETs

Silicon carbide power MOSFETs: Breakthrough performance from 900 V up to 15 kV

Silicon Carbide Power MOSFET Model and Parameter Extraction Sequence

SiC Power Devices for Microgrids

1800 V NPN bipolar junction transistors in 4H-SiC