A bulk-micromachined bistable relay with U-shaped thermal actuators

TLDR: In this paper, a DRIE-through-etched laterally bistable MEMS relay for power applications is presented, with a primary emphasis on the design and modeling of its U-shaped transient thermal actuators, and a secondary emphasis on its contact element.

Abstract: This paper reports a deep-reactive ion etching (DRIE)-through-etched laterally bistable MEMS relay for power applications, with a primary emphasis on the design and modeling of its U-shaped transient thermal actuators, and a secondary emphasis on the design and fabrication of its contact element. In this relay, a contact crossbar is carried by a curved-beam bistable mechanism , which is toggled by transient U-shaped thermal actuators with their hot beam adiabaticly heated by electrical pulses. Each U-shaped thermal actuator comprises uniform-thickness hot and cold beams with a gap between them so they bend differently. This paper develops both a basic model and a complete model for the actuator that are verified by Finite Element Analysis and serve as effective design tools. The DRIE process creates nonideal etched surfaces, which pose challenges for good relay contacts. Both contact design and process development are discussed to help alleviate this problem. The fabricated relay exhibits a minimum total on-state resistance of 60 m/spl Omega/, and a maximum current carrying capacity of 3 A. It switches with a 1 ms actuation pulse, and a maximum 5 Hz repetition rate.