Journal ArticleDOI
A review of high-temperature electronics technology and applications
Jeff Watson,Gustavo Castro +1 more
TLDR
In this paper, the authors review the applications that are calling for high temperature electronics, discuss some of the underlying problems with standard technology, and examine the established and emerging technologies that provide solutions to engineers who wish to design high-temperature electronic systems.Abstract:
Electronics that must operate at extreme temperatures present a unique set of challenges that must be carefully addressed. We review the applications that are calling for high temperature electronics, discuss some of the underlying problems with standard technology, and examine the established and emerging technologies that provide solutions to engineers who wish to design high-temperature electronic systems.read more
Citations
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Journal ArticleDOI
Homogeneous/Inhomogeneous-Structured Dielectrics and their Energy-Storage Performances.
Zhonghua Yao,Zhe Song,Hua Hao,Zhiyong Yu,Minghe Cao,Shujun Zhang,Michael T. Lanagan,Hanxing Liu +7 more
TL;DR: The optimization of high-energy-storage dielectrics will have far-reaching impacts on the sustainable energy and will be an important research topic in the near future.
Journal ArticleDOI
Polymer/molecular semiconductor all-organic composites for high-temperature dielectric energy storage.
Chao Yuan,Yao Zhou,Yujie Zhu,Jiajie Liang,Shaojie Wang,Simin Peng,Yushu Li,Sang Cheng,Mingcong Yang,Jun Hu,Bo Zhang,Rong Zeng,Jinliang He,Qi Li +13 more
TL;DR: It is shown that all-organic composites containing high-electron-affinity molecular semiconductors exhibit excellent capacitive performance at 200 °C, which is crucially important for their successful commercialization and practical application in high-temperature electronics and energy storage devices.
Journal ArticleDOI
Polymer Capacitor Dielectrics for High Temperature Applications.
Janet Ho,Steven Greenbaum +1 more
TL;DR: The present review first explains the advantages of metallized polymer film capacitors over the film-foil, ceramic, and electrolytic counterparts and then presents a comprehensive review on both past developmental effort of commercial resins and recent research progress on new polymers targeted for operating temperature above 150 °C.
Journal ArticleDOI
Dielectric polymers for high-temperature capacitive energy storage.
TL;DR: This review critically analyze the most recent development in the dielectric polymers for high-temperature capacitive energy storage applications and focuses on the structural dependence of the high-field dielectrics and electrical properties and the capacitive performance, including discharged energy density, charge-discharge efficiency and cyclability, of dielectic polymers at high temperatures.
Journal ArticleDOI
A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues
TL;DR: The standard power module structure is reviewed, the reasons why novel packaging technologies should be developed are described, and the packaging challenges associated with high-speed switching, thermal management, high-temperature operation, and high-voltage isolation are explained in detail.
References
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Journal ArticleDOI
Temperature dependence of the energy gap in semiconductors
TL;DR: In this article, a relation for the variation of the energy gap (E g ) with temperature (T ) in semiconductors is proposed. And the equation satisfactorily represents the experimental data for diamond, Si, Ge, 6H-SiC, GaAs, InP and InAs.
Journal ArticleDOI
High-temperature electronics - a role for wide bandgap semiconductors?
TL;DR: It appears unlikely that wide bandgap semiconductor devices will find much use in low-power transistor applications until the ambient temperature exceeds approximately 300/spl deg/C, as commercially available silicon and silicon-on-insulator technologies are already satisfying requirements for digital and analog VLSI in this temperature range.
Journal ArticleDOI
The changing automotive environment: high-temperature electronics
TL;DR: In this article, the authors examine the motivation for higher temperature operation, the packaging limitations even at 125/spl deg/C with newer package styles, and conclude with a review of challenges at both the semiconductor device and packaging level as temperatures push beyond 125 /spl deg /C.