Journal ArticleDOI
A wideband monolithic RMS-DC converter using micromachined diaphragm structures
Euisik Yoon,Kensall D. Wise +1 more
TLDR
In this article, a planar diaphragm structure and micromachined dielectric windows are used for thermal rms-dc conversion with a thermal efficiency greater than 7/spl deg/C/mW.Abstract:
This paper reports a monolithic rms-dc converter for measuring wideband rms signals. Two identical thermoelements for thermal rms-dc conversion are formed using planar diaphragm structures and micromachined dielectric windows. Each thermoelement consists of two polysilicon heaters and a thin-film temperature sensor located on a window and operated at constant temperature using on-chip control feedback circuitry. The thermoelements achieve a thermal efficiency greater than 7/spl deg/C/mW with a thermal time constant less than 5 ms. The on-chip control circuitry is realized using a standard 3 /spl mu/m p-well CMOS process with minor modifications for process compatibility with the dielectric window formation. This converter measures rms signals over a full scale range of 1 Vrms, handles crest factors in excess of 5, exhibits a typical nonlinearity of less than 1%, and achieves a 3 dB bandwidth greater than 20 MHz. >read more
Citations
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Journal ArticleDOI
Micromachined thermally based CMOS microsensors
TL;DR: In this article, an integrated circuit (IC) approach to thermal microsensors is presented, focusing on thermal sensors with on-chip bias and signal conditioning circuits made by industrial complementary metal-oxide-semiconductor (CMOS) IC technology in combination with post-CMOS micromachining or deposition techniques.
Journal ArticleDOI
Integrating MEMS and ICs
Andreas Fischer,Fredrik Forsberg,Martin Lapisa,Simon J. Bleiker,Göran Stemme,Niclas Roxhed,Frank Niklaus +6 more
TL;DR: Traditional as well as innovative and emerging approaches to MEMS and IC integration are reviewed, including approaches based on the hybrid integration of multiple chips (multi- chip solutions) as wellAs system-on-chip solutions based on wafer-level monolithic integration and heterogeneous integration techniques.
Journal ArticleDOI
Process-dependent thin-film thermal conductivities for thermal CMOS MEMS
TL;DR: In this article, the thermal conductivities of dielectric and conducting thin films of three commercial CMOS processes were determined in the temperature range from 120 to 400 K. The measurements were performed using micromachined heatable test structures containing the layers to be characterized.
Journal ArticleDOI
Integrating MEMS and ICs
Andreas Fischer,Fredrik Forsberg,Martin Lapisa,Simon J. Bleiker,Göran Stemme,Niclas Roxhed,Frank Niklaus +6 more
TL;DR: There are a variety of possible methods of integrating and packaging MEMS and IC components, and the technology of choice strongly depends on the device, the field of application and the commercial requirements.
Process-Dependent Thin-Film Thermal Conductivities for Thermal
Martin von Arx,O. Paul,H. Baltes +2 more
TL;DR: In this paper, the thermal conductivities of dielectric and conducting thin films of three commercial CMOS processes were determined in the temperature range from 120 to 400 K. The measurements were performed using micromachined heatable test structures containing the layers to be characterized.
References
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Journal ArticleDOI
An integrated mass flow sensor with on-chip CMOS interface circuitry
Euisik Yoon,Kensall D. Wise +1 more
TL;DR: In this article, a multielement monolithic mass flow sensor was developed for possible use in automotive and industrial process control applications, which demonstrated the use of a common microstructure (a thin dielectric window/diaphragm) for the simultaneous measurement of flow velocity, flow direction, gas type, and pressure.
Journal ArticleDOI
Thermoelectric AC power sensor by CMOS technology
D. Jaeggi,Henry Baltes,D. Moser +2 more
TL;DR: In this article, a thermoelectric AC power sensor (thermoconverter) realized by industrial CMOS IC technology in combination with postprocessing micromachining is presented.
Journal ArticleDOI
Analysis of Electrothermal Integrated Circuits
Paul R. Gray,D.J. Hamilton +1 more
TL;DR: In this article, a method of analyzing the behavior of a general configuration of lumped or distributed heaters and sensors in an integrated circuit is presented, and experimental results are presented that show close agreement with calculated values for examples of both analysis and synthesis of filters.
Journal ArticleDOI
New techniques for high-frequency RMS-to-DC conversion based on a multifunctional V-to-I convertor
TL;DR: Two bipolar RMS-DC convertor circuits of the computing type which require no rectifier function are discussed and improved frequency response is obtained.
Journal ArticleDOI
A New Wideband True Rms-to-Dc Converter
TL;DR: In this paper, a dual-heater thermistors in an automatic double bridge were used to maintain constant temperatures of both thermistors, achieving a linear linearity of 0.02 percent over a four-to-one input range, with response typically 2.5 seconds.