Open AccessDissertation
Boiling and condensation in a liquid-filled enclosure,
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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1971 as discussed by the authors, Massachusetts State University, Boston, Massachusetts, U.S.Abstract:
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1971.read more
Citations
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Patent
Modular liquid cooling of electronic assemblies
TL;DR: In this article, an electronic system includes an array of electronic assemblies at a first location within a system, and liquid cooling assemblies are placed at a second location within the system, for cooling the electronic assemblies.
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Experimental Investigation of a Direct Liquid Immersion Cooled Prototype for High Performance Electronic Systems
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Immersion Cooling of Digital Computers
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Thermal Design of Immersion Cooling Modules for Electronic Components
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Passive decay heat removal in advanced LWR concepts
TL;DR: In this paper, the authors explored the possibilities of developing a passive LWR design concept which could ensure sufficient decay heat removal in the absence of emergency primary coolant supply without exceeding the safe temperature limit on cladding, and which could achieve large nominal operating power output in the range 600-1000 MWe.
References
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Journal ArticleDOI
Hautkondensation an feingewellten Oberflächen bei Berücksichtigung der Oberflächenspannungen
TL;DR: In this paper, a condenser with vertical tubes, grooves parallel to the tube axis and given geometrical form is considered, and heat transfer coefficients are determined with calculus of finite differences.
Journal ArticleDOI
On the Hydrodynamic Transitions in Nucleate Boiling
R. Moissis,Paul J. Berenson +1 more