Journal ArticleDOI
Characteristic enhancement of white LED lamp using low temperature co-fired ceramic-chip on board package
TLDR
In this article, a low temperature co-fired ceramic-chip on board (LTCC-COB) package with improved thermal characteristics was proposed; no insulation layer exists between the LED chip and metal base.About:
This article is published in Current Applied Physics.The article was published on 2012-03-01. It has received 38 citations till now. The article focuses on the topics: LED lamp & Thermal resistance.read more
Citations
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Thermal management of LEDs: Package to system
TL;DR: In this paper, the effect of chip packages on junction to board thermal resistance was compared for both SiC and Sapphire chips, and a conceptual LED illumination system was chosen and CFD models were created to determine the availability and limitations of passive air-cooling.
Journal ArticleDOI
Application of micro/nano technology for thermal management of high power LED packaging – A review
TL;DR: A review of the literature related to thermal management of HP-LED based on the different materials and fabrication methods are used in LED packaging structure to provide a concise overview of the recent advances in this field of study.
Journal ArticleDOI
Enhanced heat transfer by room temperature deposition of AlN film on aluminum for a light emitting diode package
TL;DR: In this paper, a fully dense AlN ceramic film was successfully deposited at room temperature using the aerosol deposition method, which enabled the removal of thermal interface materials such as the adhesive thermal bonding sheets that are used in conventional metal printed circuit board (PCB)-based LED packaging process.
Journal ArticleDOI
Effective heat dissipation and geometric optimization in an LED module with aluminum nitride (AlN) insulation plate
TL;DR: In this article, an enhanced model was proposed to achieve effective heat dissipation using an aluminum nitride (AlN) insulation plate instead of the dielectric layer in a conventional chip on board (COB) LED module.
Journal ArticleDOI
Optimal thermal design of a horizontal fin heat sink with a modified-opening model mounted on an LED module
TL;DR: In this article, the authors proposed a cooling method that improves upon the poor ventilation and heat dissipation of a horizontal fin heat sink mounted on an LED module with natural convection.
References
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Proceedings ArticleDOI
Thermal management of LEDs: package to system
TL;DR: In this paper, the effect of chip packages on junction to board thermal resistance was compared for both SiC and Sapphire chips, and a conceptual LED illumination system was chosen and CFD models were created to determine the availability and limitations of passive air-cooling.
Thermal management of LEDs: Package to system
TL;DR: In this paper, the effect of chip packages on junction to board thermal resistance was compared for both SiC and Sapphire chips, and a conceptual LED illumination system was chosen and CFD models were created to determine the availability and limitations of passive air-cooling.
Journal ArticleDOI
The effect of thermal contact resistance on heat management in the electronic packaging
TL;DR: In this paper, a finite element analysis is carried out in order to investigate the role of thermal contact resistance on heat management within a simple central processing unit (CPU)/heat sink assembly, and the effect of surface roughness characteristics, mechanical and thermal properties of the contacting bodies, applied contact pressures and the use of thermal interface materials on the maximum temperature experienced by the CPU is investigated.
Journal ArticleDOI
Study of Phosphor Thermal-Isolated Packaging Technologies for High-Power White Light-Emitting Diodes
TL;DR: In this paper, a thermal-isolated encapsulant layer was used to separate the phosphor coating layer from the LED chip and the submount, which can improve the light-emitting power performance and color characteristics stability of the white LED.
Journal ArticleDOI
A review of the Nd: YAG laser marking of plastic and ceramic IC packages
TL;DR: In this article, the authors present a literature survey and discussion of the various methods and mechanisms of Nd: YAG laser marking of plastic and ceramic IC packages, and the effects of the material properties (e.g., the absorptivity and the melting point) and the marking parameters on the mark legibility characteristics, such as the mark contrast and the mark width, are reviewed.
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