Journal ArticleDOI
Effective heat dissipation and geometric optimization in an LED module with aluminum nitride (AlN) insulation plate
TLDR
In this article, an enhanced model was proposed to achieve effective heat dissipation using an aluminum nitride (AlN) insulation plate instead of the dielectric layer in a conventional chip on board (COB) LED module.About:
This article is published in Applied Thermal Engineering.The article was published on 2015-02-05. It has received 44 citations till now. The article focuses on the topics: Thermal resistance & Thermal conductivity.read more
Citations
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Journal ArticleDOI
Exfoliated boron nitride nanosheet/MWCNT hybrid composite for thermal conductive material via epoxy wetting
Kiho Kim,Jooheon Kim +1 more
TL;DR: In this paper, the authors describe the fabrication of thermally conductive composites based on an epoxy matrix with a hybrid filler of hexagonal boron nitride (h-BN) and multi-walled carbon nanotubes (MWCNTs) via the wetting method.
Journal ArticleDOI
Ternary Cu–CNT–AlN composite coatings consolidated by cold spray deposition of mechanically alloyed powders
TL;DR: In this paper, the porosity and roughness of the coatings were examined by porosimetry and profilometry, respectively, and the wettability of the coating in saturated liquid R134a refrigerant was investigated.
Journal ArticleDOI
Thermal Characteristics Analysis of Die Attach Layer Based on Time-Constant Spectrum for High-Power LED
TL;DR: In this article, a dynamic compact thermal model is constructed for an independent HP LED without being attached on a cold plate, and the time-constant spectrum method based on the thermal model was applied to characterize the transient thermal behavior of the DAA layer and other layers along the heat flow path.
Journal ArticleDOI
Analyzing the structural designs and thermal performance of nonmetal lighting devices of LED bulbs
Rong-Tsu Wang,Jung-Chang Wang +1 more
TL;DR: In this paper, the authors investigated the heat dissipation problem in light-emitting diode (LED) lighting, designed and improved the structural designs of lighting devices of LED bulbs, and employed composite materials as the lighting structural material.
Journal ArticleDOI
Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes
Yang Liu,Yang Liu,Fenglian Sun,Hao Zhang,Tong Xin,Cadmus Yuan,Cadmus Yuan,Guoqi Zhang,Guoqi Zhang +8 more
TL;DR: The experimental results demonstrate that the interfacial reactions in the Au/Sn–Ag–Cu(SAC)/ENIG and Au/SAC/Cu systems are different but the failure mechanisms of the two types of solder joints are similar during the shear test.
References
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Book
Response Surface Methodology: Process and Product Optimization Using Designed Experiments
TL;DR: Using a practical approach, this book discusses two-level factorial and fractional factorial designs, several aspects of empirical modeling with regression techniques, focusing on response surface methodology, mixture experiments and robust design techniques.
Journal ArticleDOI
Response surface methodology
TL;DR: In this article, the Response Surface Methodology (RSM) is used for scheduling and scheduling in response surface methodologies, and it is shown that it can be used in a variety of scenarios.
Book
Heat transfer handbook
Adrian Bejan,Allan D. Kraus +1 more
TL;DR: In this paper, the authors introduce basic concepts of heat transfer, including thermal spreading and contact resistances, and forced convection and external flow. But they do not consider the effect of external flow on internal flow.
Journal ArticleDOI
Experimental thermodynamic evaluation for a single stage heat transformer prototype build with commercial PHEs
J. Ibarra-Bahena,Rosenberg J. Romero,L. Velazquez-Avelar,C.V. Valdez-Morales,Y.R. Galindo-Luna +4 more
TL;DR: In this paper, an experimental single stage heat transformer (SSHT) with water/carrol mixture was analyzed. But the performance of the SSHT was not evaluated. But four test runs were carried out in order to evaluate the performance and the heat powers were measured from 0.99 to 1.35.
Journal ArticleDOI
Thermal effects in packaging high power light emitting diode arrays
Adam Christensen,Samuel Graham +1 more
TL;DR: In this paper, a thermal resistor network model was combined with a 3D finite element submodel of an LED structure to predict system and die level temperatures, and the impact of LED array density, LED power density, and active versus passive cooling methods on device operation was calculated.