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Determination of resist parameters using the extended Nijboer-Zernike theory

TLDR
In this article, an experimental method to determine the resist parameters that are at the origin of general blurring of the projected aerial image is presented, including the effects of diffusion in the horizontal plane and a second cause for image blur that originates from a stochastic variation of the focus parameter.
Abstract
This study presents an experimental method to determine the resist parameters that are at the origin of a general blurring of the projected aerial image. The resist model includes the effects of diffusion in the horizontal plane and a second cause for image blur that originates from a stochastic variation of the focus parameter. The used mathematical framework is the so-called Extended Nijboer-Zernike (ENZ) theory. The experimental procedure to extract the model parameters is demonstrated for several 193 nm resists under various conditions of post exposure baking temperature and baking time. The advantage of our approach is a clear separation between the optical parameters, such as feature size, projection lens aberrations and the illuminator setting on the one hand and process parameters introducing blur on the other.

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References
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Proceedings ArticleDOI

Image-blur tolerances for 65-nm and 45-nm node IC manufacturing

TL;DR: In this paper, the authors present a simulation methodology based on incoherent image superposition for treatment of the general aerial image effects of transverse image-blur in two dimensions, and show that the fading requirements for 65nm and 45nm node imaging notably differ from predicted exposure set-up and process contributions in manufacturing.
Proceedings ArticleDOI

Overbake: sub-40-nm gate patterning with ArF lithography and binary masks

TL;DR: In this paper, the results and findings of a full patterning process in a device flow, using "overbake" as a process enhancement, are presented, using 0.75 NA ArF lithography with phase shift masks as well as with binary masks.
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