Dynamic micromechanics on silicon: Techniques and devices

TLDR: In this paper, the authors describe fabrication procedures for constructing thin, electrostatically deflectable SiO 2 membranes on a silicon wafer in a very controllable manner, and three examples of typical applications for the micromechanical structures are discussed.

Abstract: New fabrication procedures ate described for constructing thin, electrostatically deflectable SiO 2 membranes on a silicon wafer in a very controllable manner. Performance parameters of these membranes are analyzed and three examples of typical applications for the micromechanical structures are discussed: a light modulator array, a micromechanical voltage-controlled switch, and the measurement of the mechanical properties of thin insulating films unconstrained by the substrate. Since the lifetimes of the membranes can be very long (>1010cycles), their dimensions very small (8.3 µm long, 950 A thick have been demonstrated), and the fabrication technique is simple and versatile, the potential applicability of such devices seems promising.