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Open AccessJournal ArticleDOI

Electrothermal PSpice Modeling and Simulation of Power Modules

TLDR
The implementation of a devised flow to generate the layer-based electrothermal PSpice model of an IPEM and the simulation flow of the model are described and the results are compared with a commercial finite-element-based package used as a benchmark.
Abstract
Integrated power electronics modules (IPEMs) represent an innovative typology of power electronics assemblies able to guarantee several advantages such as increasing of power density, better management of the thermal flows, and a significant reduction of the package sizes. Their characteristics make them suitable for applications like motor drives or power conditioning. IPEM usage in emerging fields like hybrid automotive traction and electric generation from renewable energy sources is continuously increasing. In this paper, we describe the implementation of a devised flow to generate the layer-based electrothermal PSpice model of an IPEM and the simulation flow of the model. The proposed modeling methodology allows reducing an electrothermal multidomain problem to an electrical single one. The general PSpice-like nature of the proposed model makes it suitable for a wide range of simulation frameworks where the integration of heterogeneous multiphysics models could be a difficult task. The outlining of both electrical and thermal PSpice layers is discussed, and the implementation into the final model, by the assistance of custom electronic-design-automation flow, is presented. Moreover, we describe the validation procedure of the proposed approach, and the results are compared with the ones obtained by a commercial finite-element-based package used as a benchmark. Two simulation approaches related to specific conversion systems, and related issues, are presented and discussed.

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Citations
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Proceedings ArticleDOI

Comparison of IGBT junction temperature measurement and estimation methods-a review

TL;DR: This paper attempts to summarize the past developments and recent advances in measuring junction temperature of power semiconductor device, and the promising methods are recommended for future work.
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New Analytical Model for Real-Time Junction Temperature Estimation of Multichip Power Module Used in a Motor Drive

TL;DR: In this paper, a new analytical electro-thermal model of a multichip power module is described, which is intended to be used during in-service conditions inside a motor drive for remaining useful lifetime calculation, in combination with a thermal cycle counting algorithm.
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High-Frequency Experimental Characterization and Modeling of Six Pack IGBTs Power Modules

TL;DR: The HF model of a six pack IGBTs PM has been developed, in the frequency range of 150 kHz-30 MHz, and it has been implemented in MATLAB environment, and the method has been experimentally validated by comparing the frequency behavior of the PM with the simulated response.
Proceedings ArticleDOI

Efficiency optimization of an integrated wireless power transfer system by a genetic algorithm

TL;DR: In this paper, a multi-objective GA for a wireless power transfer system composed of a full-bridge series-resonant inverter (FBSRI), a synchronous fullbridge rectifier (SFBR) and a buck converter was presented.
Journal ArticleDOI

A Transient 3-D Thermal Modeling Method for IGBT Modules Considering Uneven Power Losses and Cooling Conditions

TL;DR: In this article, a transient 3D thermal modeling method for insulated gate bipolar transistor (IGBT) modules is proposed to obtain accurate temperature distribution considering uneven power losses and cooling conditions.
References
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Book

The Finite Element Method in Heat Transfer Analysis

TL;DR: In this article, the authors present a time-stepping method for convective heat transfer with phase change problems and linear Steady State Problems, and a non-linear heat-conduction analysis.
Journal ArticleDOI

Junction Temperature Measurement of IGBTs Using Short-Circuit Current as a Temperature-Sensitive Electrical Parameter for Converter Prototype Evaluation

TL;DR: The proposed temperature measurement method is a valuable tool for prototype evaluation and avoids the unnecessary safety margin regarding device operating temperatures, which is significant particularly for high-temperature/high-density converter applications.

Power electronics system integration for electric and hybrid vehicles

TL;DR: In this paper, the basic requirements, concepts, and trends regarding a system integration of power electronics in hybrid (HEV) and electric vehicles (EV) are discussed, where the focus is on power modules and passive components.
Journal ArticleDOI

Packaging Technology for Electronic Applications in Harsh High-Temperature Environments

TL;DR: A system-in-package approach has been developed using thick-film technology on Si3N4 ceramic substrates using Al wire bond pads that are not compatible with Au thermosonic wire bonding for high-temperature applications.
Journal ArticleDOI

A Fast Loss and Temperature Simulation Method for Power Converters, Part II: 3-D Thermal Model of Power Module

TL;DR: The development and implementation of an analytical 3-D thermal model for fast and accurate thermal simulation of power device modules in electrothermal converter simulation and validated against the computational fluid dynamics (CFD) software package FLOTHERM and shows good agreement.
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