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Fundamental studies of Au contacts in MEMS RF switches

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TLDR
In this article, the effects of contact force and electric current on contact resistance (R), microadhesion, and reliability/durability of hot-switched gold (Au) contacts were conducted using a micro/nanoadhesion apparatus as a switch simulator.
Abstract
Microelectromechanical systems (MEMS) radio frequency (RF) switches hold great promise in a myriad of commercial, aerospace, and military applications. However, there is little understanding of the factors determining the performance and reliability of these devices. Fundamental studies of hot-switched gold (Au) contacts were conducted using a micro/nanoadhesion apparatus as a switch simulator. Experiments were conducted in a well defined air environment under precisely controlled operating conditions. Fundamental properties were connected to performance with an emphasis on the effects of contact force and electric current on contact resistance (R), microadhesion, and reliability/durability. Electric current had the most profound effect on switch performance. Observations at low current (1–10 μA) include: (1) slightly higher R; (2) asperity creep; (3) high adhesion after rapid switching; (4) switch bouncing; and (5) reasonable durability. Conversely, observations at high current (1–10 mA) include: (1) slightly lower R; (2) melting; (3) no measurable adhesion; (4) less propensity for switch bouncing; (5) necking of contacts; and (6) poor reliability and durability due to switch shorting. Low current behavior was dominated by the propensity to form smooth surface contacts by hammering, which led to high van der Waals force. High current behavior was dominated by the formation of Au nanowires that bridge the contact during separation. Data suggest the presence of an adventitious film containing carbon and oxygen. Aging of the contacts in air was found to reduce adhesion.

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Journal ArticleDOI

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Impact of Environmental Conditions on the Contact Physics of Gold Contact RF Microelectromechanical Systems ( MEMS ) Switches

TL;DR: In this paper, the impact of environmental conditions on the contact physics of Gold Contact RF Microelectromechanical Systems (MRS) switches is discussed. But the authors do not consider the effect of the weather conditions on MEMS switches.
Journal ArticleDOI

Understanding of initial unstable contact behaviors of Au-to-Au microcontact under low contact force for micro- and nano-electromechanical system devices

TL;DR: In this paper, the authors investigated the Au-to-Au micro/nano contact behavior in unstable contact region during the initial stage of contact formation under low contact force.
References
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Intermolecular and surface forces

TL;DR: The forces between atoms and molecules are discussed in detail in this article, including the van der Waals forces between surfaces, and the forces between particles and surfaces, as well as their interactions with other forces.
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Fundamentals of microfabrication

TL;DR: The second edition of the Fundamentals of Microfabrication as discussed by the authors provides an in-depth coverage of the science of miniaturization, its methods, and materials, from the fundamentals of lithography through bonding and packaging to quantum structures and molecular engineering.
Journal ArticleDOI

RF-MEMS switches for reconfigurable integrated circuits

TL;DR: In this article, the electrostatic microswitch is used in a number of existing circuits and systems, including radio front-ends, capacitor banks, and time-delay networks, for quasi-optical beam steering and electrically reconfigurable antennas.
Journal ArticleDOI

RF MEMS from a device perspective

TL;DR: The recent progress in MEMS for radio frequency (RF) applications from a device perspective is reviewed in this article, where switches and relays, tunable capacitors, integrated inductors, mechanical resonators and filters, and some representative microwave and millimetre-wave components are discussed.
Journal ArticleDOI

Micromachined devices for wireless communications

TL;DR: An overview of recent progress in the development of micromachined devices for use in wireless communication subsystems is presented in this article, where specific applications are reviewed for each of these components with emphasis on methods for miniaturization and performance enhancement of existing and further wireless transceivers.
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