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Proceedings ArticleDOI

In-Circuit Mitigation Approach of Single Event Transients for 45nm Flip-Flops

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TLDR
This work proposes a workflow for analyzing and mitigating nanometric CMOS integrated circuits to radiation-induced transient errors and proposes a tunable mitigation solution by inserting the filtering block before the storage element, tuned based on the duration and amplitude of the expected transient pulse.
Abstract
Nowadays, radiation-induced Single Event Transients are a leading cause of critical errors in CMOS nanometric integrated circuits. In this work, we propose a workflow for analyzing and mitigating nanometric CMOS integrated circuits to radiation-induced transient errors. The analysis phase starts with the developed Rad-Ray tool for mimicking the passage of the radiation particles through the silicon matter of the cells to identify the features of the generated transient pulses. The tool is integrated with an electrical simulator to evaluate the dynamic behavior of the transient pulses inserted and propagated in the circuit. A tunable mitigation solution is proposed by inserting the filtering block before the storage element, tuned based on the duration and amplitude of the expected transient pulse, identified in the analysis phase. Experimental results are achieved by applying the proposed approach on the 45 nm Flip-Flop component available in the FreePDK design kit, comparing the Dynamic Error Rate for the original Flip-Flop and the mitigated one which shows a reduction of sensitivity up to 56% with respect of the original version, with negligible degradation of performances.

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Citations
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Evaluation of Dynamic Triple Modular Redundancy in an Interleaved-Multi-Threading RISC-V Core

TL;DR: In this paper , the authors exploit the advantages of both double modular redundancy and triple modular redundancy in an Interleaved-Multi-Threading (IMT) microprocessor architecture, leveraging its replicated threads for redundancy.
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A comparative radiation analysis of reconfigurable memory technologies: FinFET versus bulk CMOS

TL;DR: In this article , a comparative radiation reliability analysis between two reconfigurable devices with different manufacturing technology: 28 nm CMOS-based and 16 nm FinFET based FPGAs is presented.
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A 3-D LUT Design for Transient Error Detection Via Inter-Tier In-Silicon Radiation Sensor

TL;DR: In this article, the authors proposed a new 3D LUT design integrating error detection capabilities, which has been designed on a two-tier IC model improving radiation resiliency by selective upsizing of sensitive transistors.
References
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Journal ArticleDOI

Gate sizing to radiation harden combinational logic

TL;DR: A gate-level radiation hardening technique for cost-effective reduction of the soft error failure rate in combinational logic circuits is described, which uses a novel gate (transistor) sizing technique that is both efficient and accurate.
Journal ArticleDOI

Single Event Transients in Digital CMOS—A Review

TL;DR: A review of digital single event transient research can be found in this paper, including a brief historical overview of the emergence of SET phenomena, a review of the present understanding of SET mechanisms, a state-of-the-art in SET testing and modelling, and a discussion of the impact of technology scaling trends on future SET significance.
Proceedings ArticleDOI

Soft Error Masking Circuit and Latch Using Schmitt Trigger Circuit

TL;DR: Construction of soft error masking latches (SEM-latches) capable of masking transient pulses occurring on combinational circuits and experimental results show that the proposed method has higher soft error tolerant capability than the existing methods.
Proceedings ArticleDOI

Tunable Transient Filters for Soft Error Rate Reduction in Combinational Circuits

TL;DR: A global optimization approach based on geometric programming that integrates TTF insertion with dual-VoD and gate sizing is described, and simulation results indicate that a 17-48X reduction in the soft error rate can be achieved with this approach.
Journal ArticleDOI

Soft error reliability in advanced CMOS technologies-trends and challenges

TL;DR: In this article, the authors review the evolution of two main aspects of soft error-SEU and SET, including the new mechanisms to induced SEUs, the advances of the MCUs and some newly observed phenomena of the SETs.
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