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Journal ArticleDOI

Increasing the thermal conductivity of boron nitride and aluminum nitride particle epoxy-matrix composites by particle surface treatments

Yunsheng Xu, +1 more
- 01 Jan 2000 - 
- Vol. 7, Iss: 4, pp 243-256
TLDR
The thermal conductivity of boron nitride and aluminum nitride particle epoxy-matrix composites was increased by surface treatment of the particles prior to composite fabrication as discussed by the authors.
Abstract
The thermal conductivity of boron nitride and aluminum nitride particle epoxy-matrix composites was increased by up to 97% by surface treatment of the particles prior to composite fabrication. The increase in thermal conductivity is due to decrease in the filler-matrix thermal contact resistance through the improvement of the interface between matrix and particles. Effective treatments for BN involved acetone, acids (nitric and sulfuric) and silane. The most effective treatment involved silane such that the coating resulted from the treatment amounted to 2.4% of the weight of the treated BN. The effectiveness of a treatment was higher for a larger BN volume fraction. At 57 vol.% BN, the thermal conductivity reached 10.3 W/ m·K. The treatments had little effect on the specific surface area of the BN particles. Silane treatments were also effective for AlN. At 60 vol.% AlN, the thermal conductivity reached 11.0 W/m·K.

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Citations
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Journal ArticleDOI

Thermal Conductivity of Polymer-Based Composites: Fundamentals and Applications

TL;DR: In this article, the fundamental design principles of highly thermally conductive composites were discussed and the key factors influencing the thermal conductivity of polymers, such as chain structure, crystallinity, crystal form, orientation of polymer chains, and orientation of ordered domains in both thermoplastics and thermosets were addressed.
Journal ArticleDOI

Review of thermal conductivity in composites: Mechanisms, parameters and theory

TL;DR: In this paper, theoretical and experimental aspects of thermal conductivity in composites, from thermal energy generation to heat transfers, are reviewed, and the fundamental mechanism of thermal conduction, its mathematical aspects, and certain essential parameters to be considered in this study, such as crystallinity, phonon scattering, or filler/matrix interfaces are discussed in detail.
Journal ArticleDOI

A review of dielectric polymer composites with high thermal conductivity

TL;DR: In this paper, the authors explore how dielectric polymer composites with high thermal conductivity have been developed and explore how fillers can be used to increase the thermal conductivities of a polymer.
Journal ArticleDOI

Polyhedral Oligosilsesquioxane‐Modified Boron Nitride Nanotube Based Epoxy Nanocomposites: An Ideal Dielectric Material with High Thermal Conductivity

TL;DR: In this article, an ideal dielectric thermally conductive epoxy nanocomposite is successfully fabricated using polyhedral oligosilsesquioxane (POSS) functionalized boron nitride nanotubes (BNNTs) as fillers.
Journal ArticleDOI

Role of interface on the thermal conductivity of highly filled dielectric epoxy/AlN composites

TL;DR: In this article, the authors report on a systematic study of the effects of interface on the thermal conductivity of highly filled epoxy composites, where six kinds of surface treated and as received AlN particles are used as fillers.
References
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Journal ArticleDOI

Very high thermal conductivity obtained by boron nitride-filled polybenzoxazine

TL;DR: A thermal conductivity of 325 W/mK was achieved for a boron nitride-filled polybenzoxazine at its maximum filler loading of 785% by volume (88% by weight) as discussed by the authors.
Journal ArticleDOI

Theory of the thermal boundary resistance between dissimilar lattices

TL;DR: It is shown that a lattice-dynamical theory for dissimilar lattices allows more phonons to be generated at the interface since it must introduce a larger unit cell.
Journal ArticleDOI

Thermal Diffusivities of Composites with Various Types of Filler

TL;DR: In this article, the in-plane and out-of-plane thermal diffusivities of Kerimid resin composites reinforced with various types of filler were studied both experimentally and theoretically.
Journal ArticleDOI

Thermal Conductivity of Boron Carbide–Boron Nitride Composites

TL;DR: In this article, the authors found that the addition of boron nitride dispersions to hot-pressed bors carbide was found to result in a considerable degree of anisotropy in thermal conductivity of the resulting composite, indicating indirect evidence for the existence of an interfacial thermal barrier.
Journal ArticleDOI

Thermally conducting polymer-matrix composites containing both AIN particles and SIC whiskers

TL;DR: In this article, aluminum and silicon carbide whiskers were used as fillers in a polyimide polymer matrix to increase the thermal conductivity of the composite, which is attributed to the large aspect ratio of the SiC whiskers, which tended to bridge adjacent A1N particles.
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