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Journal ArticleDOI

Influence of Heating and Cooling Rates of Post-Implantation Annealing Process on Al-Implanted 4H-SiC Epitaxial Samples

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TLDR
In this article, the influence of heating-up and cooling-down temperature rates on the SiC surface roughness, the crystal volume reordering and the dopant electrical activation was particularly studied.
Abstract
We report on topographical, structural and electrical measurements of aluminum-implanted and annealed 4H-SiC epitaxial samples. The influence of heating-up and cooling-down temperature rates on the SiC surface roughness, the crystal volume reordering and the dopant electrical activation was particularly studied. A higher heating-rate was found to preserve the rms roughness for annealing temperatures lower than 1700°C, and to improve the sheet resistance whatever the annealing temperature due to a better dopant activation (except for 1600°C process, which induced a dark zone in the sample volume). A complete activation was calculated for an annealing at 1700°C during 30 minutes, with a ramp-up at 20°C/s. Rising the cooling-down rate appeared to increase the sheet resistance, probably due to a higher concentration of point defects in the implanted layer.

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Journal ArticleDOI

4H-silicon carbide thin junction based ultraviolet photodetectors

TL;DR: In this paper, the photoresponse properties of 4H-SiC UV-photodetector devices based on a thin junction following their testing in darkness and under UV light over the 200 to 400 nm range were investigated.
Book ChapterDOI

Ultra-Fast Microwave Heating for Large Bandgap Semiconductor Processing

TL;DR: Tian et al. as mentioned in this paper used microwave energy for annealing lattice damage in ion-implanted SiC and GaN and for growing SiC nanowires.
Journal ArticleDOI

Electrical characteristics of SiC UV-Photodetector device : from the p-i-n structure behaviour to the Junction Barrier Schottky structure behaviour

TL;DR: In this article, the authors deal with the study of a UV photodetector device based on SiC material undergoing a p-i-n structure process, and the current densityvoltage (J-V) measurements in reverse and forward bias, are performed on the device.
Journal ArticleDOI

4H-SiC P+N UV Photodiodes: Influence of Temperature and Irradiation

TL;DR: In this article, the p+n photodiodes based on ultrathin junctions have been fabricated with distinct processes for the p-region creation: either with Aluminium conventional ion implantation, or with Boron Plasma Ion Immersion Implantation.
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