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Journal ArticleDOI

Influence of the Redeposition effect for Focused Ion Beam 3D Micromachining in Silicon

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TLDR
In this article, the influence of the redeposition effect on the focused ion beam 3D micromachining process of silicon is discussed, and avoidance methods are suggested as a result of the analysis.
Abstract
The influence of the redeposition effect on the focused ion beam 3D micromachining process of silicon is discussed. Milling of some typical patterns in which redeposition is serious has been carried out. Experimental results are analysed in combination with a theoretical model. It can be seen from the analysis that the order of recycle-milling is very important for 3D microfabrication owing to redeposition during the process. In addition, the parameters of beam current, ion beam spot size, etc. are also key factors in the process. A groove and dome shape will be formed at the root of the sidewall and the bottom of the pattern, respectively, because of the ion sputtering yield variation and sidewall redeposition. Finally, avoidance methods are suggested as a result of the analysis.

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Citations
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Journal ArticleDOI

Recent developments in micromilling using focused ion beam technology

TL;DR: The application of focused ion beam (FIB) technology in microfabrication has become increasingly popular as discussed by the authors, and this can distinguish the FIB technology from the contemporary photolithography process and provide a vital alternative to it.
Journal ArticleDOI

3D Janus Plasmonic Helical Nanoapertures for Polarization-Encrypted Data Storage

TL;DR: A unique type of 3D Janus plasmonic helical nanoaperture with direction-controlled polarization sensitivity is reported, which is simply fabricated via the one-step grayscale focused ion beam milling method.
Journal ArticleDOI

Focused ion beam scan routine, dwell time and dose optimization for submicrometre period planar photonic crystal components and stamps in silicon

TL;DR: In this paper, the effect of the number of loops at a fixed dose per hole is the parameter that determines the sidewall angle and not the dwell time by itself, and the results showed that a relatively large dwell time of 1 ms and a small loop number is favorable for obtaining vertical sidewall.
Journal ArticleDOI

A review of focused ion beam sputtering

TL;DR: The application of focused ion beam (FIB) sputtering for micro/nano fabrication has been discussed in this paper, where the maximum aspect ratio of 13:1 of the microstructures was achieved.
Journal ArticleDOI

Reconfigurable chalcogenide phase change metamaterials: a material, device, and fabrication perspective

TL;DR: A comprehensive review on the evolution of reconfigurable phase change chalcogenide metamaterials that focuses not just on a device level perspective but also examines the underlying material and fabrication considerations that are critical to obtaining optimal performance in these groundbreaking devices is presented in this paper.
References
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Book

Handbook of Charged Particle Optics

Jon Orloff
TL;DR: Computational Techniques for the Design of Charged Particle Optical Designs, (Munros Electron Optics Software, Ltd, U K) A Review of the Zr/O Schottky Cathode, (FEI Company, U S) Liquid Metal Ion Sources, (Department of Physics, University of Athens, Greece) Magnetic Lenses for Electron Microscopy, (JEOL, Ltd, Japan) Electrostatic Lenses, (Institute for Scientific Instruments of the Czech Academy of Sciences, Czech Republic) Aberrations, (Laboratoire du Opt
Journal ArticleDOI

Focused ion beam processing for microscale fabrication

TL;DR: In this article, foccused ion beam (FIB) technology has been used for micro-electro-mechanical systems (MEMS) and sensors, high-resolution trimming of YBaCuO superconducting devices, and transmission electron microscopy (TEM) sample preparation.
Journal ArticleDOI

Focused ion beam assisted chemically etched mesas on GaAs(001) and the nature of subsequent molecular beam epitaxial growth

TL;DR: In this article, focused ion beam assisted chemical etching is examined as an ultrahigh vacuum compatible in situ direct-write approach to patterning substrates to create mesas with arbitrary shapes (i.e., sidewall angles) independent of crystallographic orientation.
Proceedings ArticleDOI

Rapid fabrication of molds by mechanical micromilling: process development

TL;DR: Adaptation of this process at the microscale could lead to the rapid and direct fabrication of micromolds and masks to aid in the development of microcomponents.
Journal ArticleDOI

Recent advances in application of focused ion beam technology

TL;DR: Focused ion beam (FIB) technology has seen application in a wide variety of disciplines including microelectronic and optoelectronic device fabrication, modification, lithographic mask repair, and materials analysis as discussed by the authors.
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