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Journal ArticleDOI

Interdiffusion and Reaction in Bimetallic Cu-Sn Thin Films

King-Ning Tu
- 01 Apr 1973 - 
- Vol. 21, Iss: 4, pp 347-354
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TLDR
In this article, a Seemann-Bohlin diffractometer was used to investigate interdiffusion and intermetallic compound formation in Cu-Sn thin film couples.
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This article is published in Acta Metallurgica.The article was published on 1973-04-01. It has received 468 citations till now. The article focuses on the topics: Intermetallic & Whisker.

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Citations
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Journal ArticleDOI

Lead-free Solders in Microelectronics

TL;DR: The most widely used Pb-free solders have the eutectic composition as mentioned in this paper, which has been identified as a major factor affecting alloy selection, since this will have a major impact on the other polymeric materials used in microelectronic assembly and encapsulation.
Journal ArticleDOI

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

TL;DR: In this paper, the authors used the format of case study to review six reliability problems of Pb-free solders in electronic packaging technology and conducted analysis of these cases on the basis of thermodynamic driving force, time-dependent kinetic processes, and morphology and microstructure changes.
Journal ArticleDOI

Interfacial reactions between lead-free solders and common base materials

TL;DR: In this article, a review of the literature on interfacial reactions between pure Sn or Sn-rich solders and common base metals used in Pb-free electronics production is presented.
Journal ArticleDOI

Kinetics of interfacial reaction in bimetallic CuSn thin films

TL;DR: In this paper, the formation of Cu6Su5 between Cu and Sn thin films at room temperature and of Cu3Sn between Cu6Sn5 and Cu at temperatures from 115° to 150°'C were measured by Rutherford backscattering spectroscopy and glancing-incidence X-ray diffraction.
Journal Article

Spontaneous Growth Mechanism of Tin Whiskers

B Z Lee
- 01 Jan 1998 - 
TL;DR: In this article, a study has been made of the spontaneous growth of tin whiskers from tin electrodeposits on a phosphor bronze sheet, and the driving force for the evolution of tin worms is a biaxial compressive stress of about 8 MPa developed in tin deposits by the formation of an intermetallic compound of Cu 6 Sn 5, especially in grain boundaries of tin films.
References
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Book ChapterDOI

Diffusion in Metals

TL;DR: The theory of diffusion has followed two main approaches: (1) the more general thermodynamic approach in which the diffusing material is treated as a continuous medium and the atomic nature of the jump process is ignored, (2) the kinetic approach where a physical description is considered in terms of atomic defect movements as discussed by the authors.
Journal ArticleDOI

Accelerated growth of tin whiskers

TL;DR: It has been shown experimentally that the growth rate of tin whiskers may be accelerated up to 10,000 times the previously observed spontaneous rate by the application of pressure up to 7,500 psi as discussed by the authors.
Journal ArticleDOI

Filamentary Growths On Metal Surfaces – “Whiskers”★

TL;DR: In this article, the authors investigated the mechanism of growth of the whiskers, found not only on cadmium plated parts but also on other metals, including other materials.
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