Interdiffusion in the Al–Cu System
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This article is published in Materials Transactions Jim.The article was published on 1971-01-01 and is currently open access. It has received 174 citations till now.read more
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Bonding Mechanisms in Cold Spraying: The Contributions of Metallurgical and Mechanical Components
TL;DR: In this article, copper has been cold sprayed onto aluminium alloy substrates, the surfaces of which had been prepared in a variety of ways, including grit-blasting, and the bond strength was assessed via a novel intermetallic growth method along with adhesive pull-off testing.
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Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging.
TL;DR: High temperature aging at 250 °C for up to 196 h has been used to accelerate the aging process of the bonds and the results of micro-XRD analysis confirmed that Cu 9 Al 4 , and CuAl 2 were the main IMC products, while a third phase is found which possibly is CuAl.
Journal ArticleDOI
Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability
Hyoung-Joon Kim,Joo Yeon Lee,Kyung-Wook Paik,Kwang-Won Koh,Won Jonghoon,Sihyun Choe,Jin Lee,Jung-Tak Moon,Yong-Jin Park +8 more
TL;DR: In this paper, the formation of Cu/Al IMC was observed and the activation energy was obtained from an Arrhenius plot (ln (growth rate) versus 1/T).
References
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Journal ArticleDOI
The evaluation of data obtained with diffusion couples of binary single- phase and multiphase systems.
TL;DR: A simplified derivation of the principal equation for the calculation of interdiffusion coefficient D as a function of mol fraction N2 is presented in this article, where values of these integrals are related to the parabolic rate constants for the growth of compound layers in diffusion couples under various conditions.
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Some aspects of the growth of diffusion layers in binary systems
TL;DR: In this paper, it was shown that the application of Fick's First law to polyphase diffusion in binary systems leads to simple but rigorous expressions for the interface positions as functions of time and temperature.
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Diffusion of Copper in Nickel and Aluminum
TL;DR: In this article, the diffusion of copper in nickel and aluminum has been studied by the residual activity technique in the temperature ranges of 850° to 1050°C and 350° to 630°C, respectively.