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Open AccessJournal ArticleDOI

Investigation of the thermal performance of a novel flat heat pipe sink with multiple heat sources

TLDR
In this article, a flat heat pipe sink with multi-heat sources (a heat sink configured with four flat heat pipes) has been developed and fabricated in order to realize high heat transport performance.
About
This article is published in International Communications in Heat and Mass Transfer.The article was published on 2018-05-01 and is currently open access. It has received 20 citations till now. The article focuses on the topics: Heat sink & Thermal resistance.

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Citations
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Journal ArticleDOI

Evaluation of heat sink performance using PCM and vapor chamber/heat pipe

TL;DR: In this article, a numerical study on heat sink thermal performance using phase change materials (PCM) and a vapor chamber for heat source cooling is presented, where the influence of various geometrical parameters such as number, height and thickness of fins for three different modes of conventional heat sink, PCM-based heat sink and heat sink integrated with vapor chamber is studied.
Journal ArticleDOI

Hotspot thermal management in microchannel heat sinks with vortex generators

TL;DR: In this paper, a numerical study of hotspot-targeted thermal management using VGs is performed in a rectangular microchannel with a heat flux of 400 W/cm2 and 50 W/ cm2 respectively at the hotspot and background region.
Journal ArticleDOI

Experimental investigation of the effect of nanofluids on the thermal resistance of a thermosiphon L-shape heat pipe at different angles

TL;DR: In this paper, the effects of water/SiO2 nanofluids on the thermal resistance of an L-shaped heat pipe were investigated, and the results showed that thermal resistance decreased with the increase in weight concentrations to 0.5% while it increased with the angle reduction.
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A review on data centre cooling system using heat pipe technology

TL;DR: In this paper , a comprehensive review on heat pipes for use in data center cooling systems will be carried out, starting from the working principle, heat transfer analysis and applications, and the review works will be analyzed in terms of the system research methodology, energy performance evaluation, and IT tasks.
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Experimental research of capillary structure technologies for heat pipes

TL;DR: In this paper, the authors present an experimental study on three different capillary structure technologies of heat pipes for application in the thermal management of electronic packaging, and the experimental results showed that all capillary structures for heat pipes worked successfully, so the studied manufacturing methods are suitable.
References
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Journal ArticleDOI

Loop heat pipes

TL;DR: Loop heat pipes (LHPs) as mentioned in this paper are two-phase heat-transfer devices with capillary pumping of a working fluid, which can transfer heat efficiency for distances up to several meters at any orientation in the gravity field, or to several tens of meters in a horizontal position.
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Advances and Unsolved Issues in Pulsating Heat Pipes

TL;DR: Pulsating (or oscillating) heat pipes (PHP or OHP) are new two-phase heat transfer devices that rely on the oscillatory flow of liquid slug and vapor plug in a long miniature tube bent into many turns.
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Review of cooling technologies for computer products

TL;DR: This paper provides a broad review of the cooling technologies for computer products from desktop computers to large servers in terms of air, hybrid, liquid, and refrigeration-cooled systems.
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Thermal performance of flat-shaped heat pipes using nanofluids

TL;DR: In this article, the authors investigated the thermal performance of flat-shaped and disk-shaped heat pipes using nanofluids and found that the nanoparticles presence within the working fluid results in a decrease in the thermal resistance and an increase in the maximum heat load capacity.
Journal ArticleDOI

Experimental study of the thermal performance of thermosyphon heat pipe using iron oxide nanoparticles

TL;DR: In this article, the authors presented an experimental investigation regarding the use of solid nanoparticles added to water as a working fluid, which was made on a thermosyphon heat pipe.
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How do you connect a heat sink to a transistor?

Compared with conventional heat sink, the novelty of this passive heat transfer device is capable of realizing high heat transport performance.