Journal ArticleDOI
Mechanical properties of nano-silver joints as die attach materials
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TLDR
In this paper, the development of silver (Ag) as a die attach bonding material in the microelectronic packaging industry from its early days as micron-scale silver flakes to the recent nanoscale Ag paste and other derivatives is discussed.About:
This article is published in Journal of Alloys and Compounds.The article was published on 2012-02-15. It has received 321 citations till now.read more
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Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging
TL;DR: In this paper, the authors discuss the main methods of applying Ag pastes/laminates as die-attach materials and the related processing conditions, and the long-term reliability of sintered Ag joints.
Journal ArticleDOI
Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications
TL;DR: The theoretical background and transition of applications from micro to nanoparticle (NP) pastes based on joining using silver filler materials and nanojoining mechanisms are elucidated, and the future outlook for joining applications with silver nanomaterials is explored.
Journal ArticleDOI
Review of silver nanoparticle based die attach materials for high power/temperature applications
TL;DR: A broad and general understanding of the sintering processes is presented to help researchers produce desired sintered structures, such as the understanding that higher sintered pressure causing improved strength might potentially reduce the long term thermal resistance of the die attach.
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Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability
TL;DR: In this article, a review of parameters affecting the initial shear strength of the sintered silver joint is presented, as well as the high temperature long-term reliability issues.
Journal ArticleDOI
A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding
TL;DR: In this article, the authors developed a one-pot method for the synthesis of Cu nanoparticles capped with fatty acids and amines from an insoluble salt, such as Cu carbonate and Cu hydroxide, in ethylene glycol.
References
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Intermolecular and surface forces
TL;DR: The forces between atoms and molecules are discussed in detail in this article, including the van der Waals forces between surfaces, and the forces between particles and surfaces, as well as their interactions with other forces.
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Deformation and Fracture Mechanics of Engineering Materials
TL;DR: In this article, the authors present an overview of fracture mechanics of engineering materials and examine the role of the transition temperature approach to fracture control in the engineering failure process, as well as various aspects of fracture toughness.
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Recent advances in the liquid-phase syntheses of inorganic nanoparticles.
TL;DR: The development of novel materials is a fundamental focal point of chemical research; and this interest is mandated by advancements in all areas of industry and technology.
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Shape Control of Colloidal Metal Nanocrystals
TL;DR: In this paper, an overall picture of shaped metal particles is presented, with a particular focus on solution-based syntheses for the noble metals, emphasizing key factors that result in anisotropic, nonspherical growth such as crystallographically selective adsorbates and seeding processes.
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Structural properties of nanoclusters: Energetic, thermodynamic, and kinetic effects
TL;DR: In this paper, a review of the experimental methods for the production of free nanoclusters is presented, along with theoretical and simulation issues, always discussed in close connection with the experimental results.