Journal ArticleDOI
Millimeter-Wave Technology for Automotive Radar Sensors in the 77 GHz Frequency Band
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TLDR
In this paper, the authors provide background and an overview of the state of the art of millimeter-wave technology for automotive radar applications, including two actual silicon based fully integrated radar chips.Abstract:
The market for driver assistance systems based on millimeter-wave radar sensor technology is gaining momentum. In the near future, the full range of newly introduced car models will be equipped with radar based systems which leads to high volume production with low cost potential. This paper provides background and an overview of the state of the art of millimeter-wave technology for automotive radar applications, including two actual silicon based fully integrated radar chips. Several advanced packaging concepts and antenna systems are presented and discussed in detail. Finally measurement results of the fully integrated radar front ends are shown.read more
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Reconfigurable metamaterial-based antenna using a novel class of miniaturized agile unit-cells.
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Asymmetric Ground Rotman Lens for Multilayer Packages
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79 GHz Multilayer Series-Fed Patch Antenna Array With Stacked Micro-Via Loading
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References
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Book
Introduction to Radar Systems
TL;DR: This chapter discusses Radar Equation, MTI and Pulse Doppler Radar, and Information from Radar Signals, as well as Radar Antenna, Radar Transmitters and Radar Receiver.
Journal ArticleDOI
A 77-GHz Phased-Array Transceiver With On-Chip Antennas in Silicon: Receiver and Antennas
TL;DR: The receiver and the on-chip antenna sections of a fully integrated 77-GHz four-element phased-array transceiver with on- chip antennas in silicon are presented.
Journal ArticleDOI
A 77-GHz Phased-Array Transceiver With On-Chip Antennas in Silicon: Transmitter and Local LO-Path Phase Shifting
TL;DR: In this article, the first fully integrated 77-GHz phased-array transceiver is presented, which utilizes a local LO-path phase-shifting architecture to achieve beam steering and includes four transmit and receive elements, along with the LO frequency generation and distribution circuitry.
Proceedings ArticleDOI
Embedded wafer level ball grid array (eWLB)
TL;DR: In this paper, Infineon's embedded Wafer level Ball Grid Array (WLB) technology is presented, which allows fitting interconnects onto a so-called fan-out area extending the chip area.
Journal ArticleDOI
Micromachined patch antennas
TL;DR: In this article, the authors used selective lateral etching based on micromachining techniques to enhance the performance of rectangular microstrip patch antennas printed on high-index wafers such as silicon, GaAs, and InP.