Proceedings ArticleDOI
Performance comparison of thermal interface materials for power electronics applications
Deepak Gautam,Dale Wager,Murray Edington,Fariborz Musavi +3 more
- pp 3507-3511
TLDR
In this article, a detailed comparison of the properties of various off-the-shelf available TIMs to be specifically used between PCB with thermal vias and heat sink is presented, and experimental results are presented to determine the thermal performance of various TIMs.Abstract:
One important challenge in power electronics design is removing the heat cost effectively from the power devices mounted on thermal vias on a printed circuited board (PCB). Thermal vias is a cluster of small diameter hole plated with copper and is used to transfer the heat from one side of the PCB where the power device is soldered to the other side which is generally mounted on a heat sink using a thermal interface material (TIM). To minimize the contact resistance and provide electrical insulation between the PCB and heat sink, TIMs are used to fill the air gaps and are an essential part of an assembly when solid surfaces are attached together. This paper presents a detailed comparison of the properties of various off-the-shelf available TIMs to be specifically used between PCB with thermal vias and heat sink. Experimental results are presented to determine the thermal performance of various TIMs.read more
Citations
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High-Power-Density GaN-Based Converters: Thermal Management Considerations
Edward A. Jones,Michael de Rooij +1 more
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Performance evaluation of a 650V E-HEMT GaN power switch
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Modular heat sink for chip-scale GaN transistors in multilevel converters
Nathan Pallo,Chirag R. Kharangate,Tomas Modeer,Joseph Schaadt,Mehdi Asheghi,Kenneth E. Goodson,Robert C. N. Pilawa-Podgurski +6 more
TL;DR: In this article, a modular approach for forced-air heat sinking is proposed, where variation in height can be accommodated per device while electrical isolation may no longer be necessary, and a 3D-printed manifold is presented as a means to favorably direct forced air across the cooling surfaces.
References
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Proceedings ArticleDOI
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TL;DR: In this article, a 3.3kW two-stage battery charger design is presented for a plug-in hybrid electric vehicle (PHEV) application to achieve high efficiency, which is critical to minimize the charger size, charging time and the amount and cost of electricity drawn from the utility.
Proceedings ArticleDOI
Optimization of thermal via design parameters based on an analytical thermal resistance model
TL;DR: In this paper, a simple analytical model that provides an efficient approach for analysis of thermal via pads is presented, where small vias close to one another form a cluster with a relatively large dimension.
Proceedings ArticleDOI
PCB Thermal Via Optimization using Design of Experiments
TL;DR: In this paper, a fractional factorial designed experiment (DOE) was developed using MINITABtrade statistical software for the following thermal via and PCB factors, evaluated at two levels: via diameter, pitch, and barrel thickness as well as PCB top Cu pad area and number of metalized layers.
Proceedings ArticleDOI
A review of thermal management in power converters with thermal vias
TL;DR: In this paper, a thorough literature review of the design and analysis of thermal vias in PCBs for thermal management of devices in power electronics converters is presented, based on the conclusions drawn from the available literature and practical manufacturing guidelines, four different via patterns for a single power device are selected and their thermal performances are studied.
Proceedings Article
PCB thermal design improvement through thermal vias
TL;DR: An approach based on design of different experiments for improvement the thermal paths in PCB through thermal vias is offered in this article, where an efficient thermal via placed on the PCB decreases the junction temperature of the package.
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